Electronics Forum | Mon Mar 19 08:26:37 EST 2001 | hany_khoga
Dear All: We have a problem of soldering big BGA's (3.5Cm * 3.5 Cm)during rework or repair. With three big companies stations (hot air & infrared) with their support, they faild to re-solder even one BGA succesfully. Note that we workes on a good te
Electronics Forum | Tue Apr 12 19:31:39 EDT 2005 | davef
Tell your fab that you'd like your ENIG according to IPC-4552. Just so that you know, IPC-4552 ENIG specification: * Ni thickness: 3 - 6 microns [120 - 240 microinches]. * Au thickness: 0.075 - 0.125 microns [3 - 5 microinches]. * Recommended spec
Electronics Forum | Thu Jul 07 11:41:54 EDT 2005 | patrickbruneel
Thanks for the response Dave This whole lead free joke gives me ulcers Compare the findings in the real world (threads in this forum) with the conclusions from the lead free industry counsel. The SAC305 is announced the "alloy of choice" here's a li
Electronics Forum | Tue Oct 28 19:47:05 EDT 2008 | davef
Your gold might be a bit thin after you consider fabricator's tolerance. IPC-4552 ENIG specification: * Ni thickness: 3 - 6 microns [120 - 240 microinches]. * Au thickness: 0.075 - 0.125 microns [3 - 5 microinches]. * Recommended specification is
Electronics Forum | Tue Jan 21 16:11:05 EST 2020 | dgiordano
3.3.5.1 HIC Placement states "The HIC may be placed anywhere in the MBB, but should not be placed under, on top or touching a desiccant pouch." How do you assure that the HIC doesn't touch the desiccant pouch? Do you secure the HIC to the reel or to
Electronics Forum | Fri Jan 20 12:46:21 EST 2012 | deanm
If 3-5% of the attempted parts placed are dropped, you have a serious problem...that's 1 part dropped for every 20 or 30 placements. Does it mean that it drops the part in the scrap bin and then successfully places the same part or would the board co
Electronics Forum | Tue Apr 26 05:04:10 EDT 2005 | siverts
Sorry for my blackout, but here it comes: Solder paste: Senju 7100-GRN360-K1MK-VS Sn 95.5 Ag 3.9 Cu 0.6 Solder wire: Kester 24-7040-8834 Sn 96.5 Ag3.5 Regards,
Electronics Forum | Fri Feb 25 04:28:49 EST 2000 | Sze-Pei LIM
We faced terrible void issue while using Sn96.5Ag3.5 solder paste, more than 20% void. We tried adjusting the reflow oven profiles but we did not have much success in reducing the void. Generally, we find quick preheat, high peak temp. and fast cooli
Electronics Forum | Fri Feb 25 04:28:49 EST 2000 | Sze-Pei LIM
We faced terrible void issue while using Sn96.5Ag3.5 solder paste, more than 20% void. We tried adjusting the reflow oven profiles but we did not have much success in reducing the void. Generally, we find quick preheat, high peak temp. and fast cooli
Electronics Forum | Thu Aug 27 09:18:57 EDT 2015 | fcmtechnician
Hi Don't know your reflow brand, but try to decrease the blower speed...is possible that air blow out the componets! For vibration, chain related issue, etc open your hood and start the oven in colder recipe with pcb inside! ( put the service key o
