Electronics Forum | Mon Jul 01 04:50:04 EDT 2019 | sssamw
Yes, No standard.Normally QFN supplier suggest 50-75 um (2-3 mil), but it's very hard to achieve and hard to make consistent stand-off in prodution.
Electronics Forum | Thu Sep 17 03:36:47 EDT 2020 | SMTA-64386317
Hi All, Is there any specific control for solder height and volume? Such as 3 mil what will be the height and volume upper and lower limit?
Electronics Forum | Thu Apr 29 10:11:41 EDT 1999 | Cunli
| Can anyone in this world produce such small PCB/PWB trace widths? Lots of theory so far, but have not found anyone yet who can do it in practice. | Dan, I have seen boards with 3 mil pitch (that is 1.5 mil trace and 1.5 mil spacing) in quantity
Electronics Forum | Sun Nov 22 18:03:38 EST 2015 | ttheis
Hi Deni- Thanks for the reply. I'll try to figure out what vision system is on it. I know it has two 5.3mil cameras front and back, UPS 3.2.2c os/2. Where do I determine the type of vision system; in the computer or harware spec plate?
Electronics Forum | Tue Jan 08 09:23:18 EST 2013 | lock_2002
This is a question regarding soldermask between pins of fine pitch devices. The majority of our production designs end up with at least 2-3 mils of copper thickness on the external layers due to blind vias, wrap plating requirements, etc. Our curre
Electronics Forum | Sun Nov 22 10:05:37 EST 1998 | Christopher Lampron
| Does any body know stencil manufacturer in states or south east asia for electroforming processes and step down from 5mil to 3mil. | | Thanks! | Daniel, I do alot of work with Photoetch stencils in Massaschusetts. I do not have the Phone number h
Electronics Forum | Fri Oct 18 22:32:20 EDT 2002 | mdm4ua
If you have room try putting a small piece of tape on the bottom of the stencil right next the aperture that is giving you the problem. The added height of the tape (Kapton tape is usually about 3 mils thick) will likely give you a heavy enough depo
Electronics Forum | Tue Mar 02 10:24:06 EST 2004 | russ
I have done this before, We print with a 5-6mil stencil and have had no problems with any underneath solder. If you are still nervous instead of removing from stencil use some 3 mil kapton tape or equivelant and tape off the BGA pads. This way the
Electronics Forum | Fri Mar 18 03:53:16 EST 2005 | devilhitam
hi guys, I need a help here. Does anyone know what is the standard for coplanarity check for fine pitch IC that well practiced? I am using SIEMENS F5 for fine pitch IC placement.SIEMENS F5 do have the capability for coplanarity check. My customer re
Electronics Forum | Wed Dec 21 11:49:50 EST 2005 | dlkearns1
We have small blisters all over the bottom side of a heatsink the measures apprx 4" x 12", flat surface. Is there any chance someone can refer me to some standard or specs for usability, personally I think these little blisters would be ok and not in
.gif)
