Electronics Forum: 4

16 mil pitch QFPs / solder paste type 4 & 5?

Electronics Forum | Mon Apr 07 11:39:55 EDT 2003 | russ

How thick is your stencil? We print 16mil every day with type 3 paste 2 of which you have tried (Alpha and Kester) Stencil should be 5 mil. Russ

SRT -1000 BGA rework system

Electronics Forum | Wed Jul 30 23:16:01 EDT 2003 | praveen

The profile is enclosed.The PBGA is 37x37 mm.I am keeping the gap about 4-5 mm.The profile meets the solder paste spec.Peak temp is 211 deg C,Above melting point 77 sec. rate of heating

PBGA vias throwing solder balls

Electronics Forum | Wed Sep 15 22:43:24 EDT 2004 | davef

Just to help convince those on the fence that we don't know dip: 2221A, 4.5.1 tells you the vias have to be tented on both sides.

Same wave process do not apply to all finish board

Electronics Forum | Fri Oct 14 08:12:48 EDT 2005 | lyrtech

For LUPO: speed: 4.5 inch alloy: 63Sn/37Pb Solder pot temperature: 500 Quantity of flux: just to wet the board

Hidden Pillow Phenomenon

Electronics Forum | Thu Nov 16 11:40:03 EST 2006 | CK the Flip

I know Indium was big into the "ambient-to-peak" parameter, so now I know why. For their Sn/Pb paste, they recommended an EXACT number - I believe it was 4.5 minutes.

Baking Moisture Sensitive Components >4.5mm

Electronics Forum | Thu Jan 18 21:45:34 EST 2007 | davef

Take this chance to update your documentation. See Appendix B in: http://www.jedec.org/DOWNLOAD/search/jstd033b.pdf How much fun is that going to be? As an alternative, maybe your supplier can save you the pain.

Need a new Pick/Place. Recommendations?

Electronics Forum | Thu Apr 05 16:03:38 EDT 2007 | beentheredonethat

Definitely recommend the Siemens F4/5 machine for your application. Based on experience I can say placement accuracy/repeatability is DNO (that�s Dead Nuts On). Good luck.

OT: Wavesolder Process Engineer Needed

Electronics Forum | Mon Jul 14 17:55:16 EDT 2008 | gregoryyork

This could happen if your angle was wrong on the machine. If its a Chinese machine then probably 4 - 5 Deg. With the wrong angle the solder will only drain in one direction instead of both. cheers greg

BOTTOM SIDE CHIP COMP FALLEN OFF IN WAVE SOLDER

Electronics Forum | Thu Dec 10 06:01:22 EST 2009 | gregoryyork

have you checked solder resist cure as this will cause the glue to lose adhesion if not cured correctly especially if dwell time sin the wave are excessive i.e 4-5 seconds cheers Greg York

MY DATA HYDRA TOOL LENGTH EROR

Electronics Forum | Mon Aug 19 16:42:07 EDT 2013 | thanh567

W- HTLM-5 :Hydra tool length wrong for tool tube 3. expected tool length 4.5mm, tool length found -1.358mm any one out there know what to look for this issue? sensor?


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