Electronics Forum | Wed May 05 17:18:38 EDT 2004 | davef
It's a Furukawa proprietary material. 'Google' on just the 'EFTEC 64T'. [Sometimes it's Cu EFTEC 64T, copper EFTEC 64T, sometimes just EFTEC 64T.] For instance, Table 5-2 in: http://developer.intel.com/design/packtech/ch_05.pdf
Electronics Forum | Thu Sep 27 10:40:46 EDT 2007 | rgduval
Joris, Yep, very common to have those small blow holes in lead-free alloys. We used to get them very consistently on white-tin finished boards, and less frequently with gold finished boards, for what ever that is worth. IPC-610 actually allows t
Electronics Forum | Fri Oct 03 09:00:18 EDT 2003 | davef
EIA standard packages have a variety of L/W proportions. EIA||Dimension mm (LXW)||Proportion (L/W) 0201||0.6X0.3||2 0202||0.5X0.5||1 0303||0.8X0.8||1 0402||1.0X0.5||2 0504||1.25X1.0||1.25 ||1.4X1.4||1 0603||1.6X0.8||2 0805||2.0X1.25||1.6 1111||2.8X2
Electronics Forum | Tue Mar 26 23:26:35 EST 2002 | ianchan
Hi Guys, (Note: We are not talking about bill-board RES/CAP, we are talking about Z-axis slant/tilted RES/CAP with respect to the PCB pad Z-axis plane). 1) We ref through the IPC-A-610C specification "bible", and can not find a "chapter/verse" tha
Electronics Forum | Tue May 28 17:50:20 EDT 2002 | myu
Hi, Everybody! I'm looking for a High-Temperature Solder Paste / wire: "Pb93WROL140.71454";or "00Z890"; J-STD-006 Solder Alloys Sn05Pb93Ag02B Sn% Pb% Ag% Solid C Liq C Solid F Liq F 5.0 92.5 2.5 280 284 536 543 It should meet IPC/J-ST
Electronics Forum | Mon Apr 01 13:47:38 EDT 2013 | microaide
Anyone know how to use AutoProgram 5.32 for the Quad IVc assemblers? I am having all kinds of problems. I can't create a new SMD Type because the Edit menu is greyed out, so I can't select New. I can't figure out how to set up feeders and assign feed
Electronics Forum | Wed Oct 28 23:01:57 EST 1998 | Dave F
| I would like to know if there are any standard guidelines for the development of Process Failure Mode and Effect Analysis. If there is can you refer me to the source. | | I would also like to be referred to any source relating to current developme
Electronics Forum | Fri Jun 11 18:01:48 EDT 2004 | davef
Bob: This links to a good discussion on scoring by George Verboven. [It discusses "keepout", but doesn't address your question, because George's "keepout" is not the same as yours]: http://www.tkb-4u.com/articles/other/vscore/vscore.php The infor
Electronics Forum | Mon Jan 03 16:34:10 EST 2005 | davef
The main advantage if ENIG over HASL is that ENIG is flat and HASL generally is not. The main disadvanages to ENIG over HASL are: * Cost of ENIG is 1.5 - 2X higher than HASL * Selflife is less than HASL * You solder to nickel, rather than copper * E
Electronics Forum | Thu Oct 05 15:58:16 EDT 2006 | RusH
Mario, Thanks for your response. We are building a leaded assembly with hot air leveled Sn/Pb pads on the PCB. In one case the component is a 7.5X5.2X1.8 wire wound ferrite inductor with Au/Sn leads. The second component is an 0808 Tantalum cap,
