Electronics Forum: 7351 (Page 2 of 5)

Electromigration Testing

Electronics Forum | Wed Sep 15 17:13:53 EDT 2004 | GS

Do anyone of you know if are there any Standard (IPC, JEDEC, etc) telling how much can be the acceptable level of TIC (ugr/cm2 NaCl equivalent) allowed on surace of Connectors, Components,before to be assembled on PCB ? Many thanks Rgds GS

Library for all SMD packages with dimensions

Electronics Forum | Mon Oct 31 08:47:27 EST 2005 | jdengler

IPC-7351 is the most complete I have found but is still missing some. Look here http://www.ipc.org/contentpage.asp?Pageid=4.6 Jerry

SMD nomenclature

Electronics Forum | Fri Apr 06 09:36:46 EDT 2007 | pjc

FYI: IPC-SM-782 has been superseded by IPC-7351A, IPC-SM-782 land patterns previously found under the "Manufacturer Part Number" database portion of SM-782 Land Pattern Calculator are no longer maintained by IPC.

Description of all the various mounting packages

Electronics Forum | Thu Aug 16 12:52:41 EDT 2007 | russ

DAVE, Does this '7351 supercede the IPC-SM-782?(surface mount design and land pattern standard) how about IPC-CM-770? (guidelines for printed board component mounting) those are the two that I have? Russ

SOLDER COST MODEL - PAD SIZE

Electronics Forum | Mon Dec 09 16:10:50 EST 2013 | davef

IPC-7351 Land Pattern Calculator and Tools [landpatterns.ipc.org/] Generic requirements for surface sount Design and Land Pattern Standards, is supplemented by a footprint expert software tool

Minimum Component Spacing with Minimum Solder Mask Width of 4mils

Electronics Forum | Mon May 19 15:13:05 EDT 2014 | davef

Consider this combination: * IPC-7351B - Generic Requirements for Surface Mount Design and Land Pattern Standard * IPC Tools & Calculators [ipc.org/contentpage.aspx?pageid=PCB-Tools-and-Calculators ] * Component fabricator suggestions BR ... davef

Aperture or Pad requirement for 0805 Package Inductor

Electronics Forum | Sun Nov 10 16:07:31 EST 2013 | davef

First, require use of the IPC-7351B Standard as the sole basis for laying-out pads on circuit boards. Second, if someone wants to use a pad design that either: * Wasn't covered in IPC-7351B ... OR * Was for a component that was in the standard but

0402's for the first time!

Electronics Forum | Tue Jul 24 08:22:16 EDT 2001 | markhoch

We're getting geared up to start placing 0402 comps. for the first time. I'm trying to "touch all my bases" before we actually go live. I've verified our placement machine capabilities and investigated my solder paste performance in regards to 0402'

Part clearances in PCB design

Electronics Forum | Tue May 04 22:54:54 EDT 2004 | davef

Yeh, the IPC courtyards are for old ladies. I want to say that at one time IPC was talking about a new set of rules. Maybe, 7351 - SMT Footprint Design Guidelines??? Anyhow, Jim Blankenhorn at SMTPlus [ sales@smtplus.com ] has done THE best job o

Mosfet stencil design

Electronics Forum | Thu Jul 21 09:43:10 EDT 2005 | davef

We agree with Russ. The solderballs are probably the result of printing too much paste on the board. In designing your 5 thou thick stencil: * Aperatures for the pads should be identical to a IPC-7351 - SO8 [or worst case http://www.vishay.com/docs


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