Electronics Forum | Wed Apr 30 12:30:14 EDT 2003 | Guillermo
Hello, I would like to ask for cooments/advices about the inspection of small solder deposits inspection (aprox 4 mills). We tried with X ray and Scanning acoustic microscope but it looks like due to the small size, we could not be sure to get all t
Electronics Forum | Wed Mar 04 13:06:45 EST 2015 | cyber_wolf
A full blown analysis could become very expensive. There are many test that can be performed. 3D acoustic microscopy, X-ray, Dye and pry,and I'm sure the list goes on. Typically, a micro-cross section report of the BGA solder joints will show you w
Electronics Forum | Tue Jul 31 20:00:08 EDT 2001 | davef
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Electronics Forum | Sat Apr 08 08:43:34 EDT 2000 | Dave F
Hi Gary: Generally: http://www.tmworld.com/db_prod/companiesbyproduct.cfm?PRODUCTCODENUMBER=201.0∏UCTNAME=Acoustic%20Emission%2FPIND%20Testers LR has a couple of used B&Ws for sale at: http://www.lre.com/test/searchresultx.asp But the coolest, l
Electronics Forum | Tue Jun 19 11:57:35 EDT 2001 | Gil Zweig
As you probably know, x-ray inspection has problems positivly identifying cracks or delamination. This task is more suited to scanning laser acoustical microscopy but the cost is very high. It has been our experience that cracks are associated with t
Electronics Forum | Wed Oct 03 17:06:43 EDT 2001 | davef
Yes, moisture entrapment causes solder shorts 80% of the time. Cracks occur bottom side of the BGA. Use an acoustic microscope to find the cracks. So, what makes you think your BGA are blowing-off steam? I posted a vid on SMTnet that showed the b
Electronics Forum | Sat Jul 02 08:01:37 EDT 2005 | davef
Comments are: * A good looking solder ball does not necessarily mean that you have a good solder connection between the ball and the pad. We've all seen a bright and shiney solder ball on the floor, but that doesn't mean there's a good metalurgical
Electronics Forum | Fri Jun 16 18:48:57 EDT 2006 | GS
Hi Grant, just my opinion, I think the concern could be related to the extra temperature the BGAs have been exposed during the Lead Free Reflow Temperature. So you need to check ( data sheet) what is the max temperature and how long the Pb/BGA can w
Electronics Forum | Thu Apr 27 21:04:33 EDT 2000 | Dave F
Ron: Good news: Nicolet makes excellent machines. Bad news: I�m unaware of a machine with the capabilities you seek. * X-ray machines lack of resolution needed in relation to the crack geometries encountered within a high density single material.
Electronics Forum | Thu Apr 26 16:52:53 EDT 2001 | fmonette
Robert, Someone already mentioned the popcorning phenomena. This would show up as a dome-shaped deformation underneath the component, due to internal delamination around the die area. However what you describe sounds like another moisture-related