Electronics Forum: action (Page 2 of 46)

Reflow Oven Exhaust Temperature

Electronics Forum | Mon Jun 22 19:17:07 EDT 2020 | bmalhi

There are many things that can cause this and several solutions. Suggest having Heller Service Tech come in put some thermocouples at various points and determine the best course of action. If in-person visits are not possible at this time, we can wa

Solder Beading under Cap...Need help

Electronics Forum | Fri Feb 11 08:24:51 EST 2000 | Masdi

Hi, Need help. We are starting to see a lot of small solder under capacitors and some of them can be bigger than 10 mils. For current action, we have checked through screen print process and component placement but still don't have any clue on how

About the PCB gold finger contamination.

Electronics Forum | Sun Sep 22 13:14:56 EDT 2002 | scottefiske

Stop the lines...! Stop building defects and rework into your product. Contact Fab Supplier and have pipeline filled for small amount of replacement fabs to keep lines running and limiting production scheduling and impact. Request to have the board

How to prevent defective material from getting to stock?

Electronics Forum | Thu Aug 14 14:01:03 EDT 2003 | Andrea

I was recently given a copy of the "Tin Whisker Agency Action Notice" I was then asked to recommend and implement a action to prevent the suseptible components from reaching our stockroom. Since I can not commit my personel to activly research which

Assembleon FCM Base II Cermamic - need info.

Electronics Forum | Thu May 31 03:12:18 EDT 2007 | vinitverma

Hi John, You can write to me offline at vinit.verma@prosemtechnology.com and write the exact problem that you face after you have generated the action spec using PPS Pro 8.1. What is the problem that you're facing. The coordinate system is taken ca

Minimum lead pitch to avoid bridging

Electronics Forum | Thu Jul 05 19:37:15 EDT 2007 | davef

We assume the three leads are lined-up perpendicular to the wave. Without taking corrective action, we know this: * 50 thou pitch will bridge * DIP do not bridge As a corrective action that doesn't invovle a respin of the board, decrease the solderm

SMT Disasters

Electronics Forum | Wed Jul 09 08:32:11 EDT 2008 | davef

In our shop, a very large portion of the mistakes in the shop have their genesis with someone one other than the person making the mistake. Often, it is a chain of events that lead to the mistake. How do your picture posting systems drill down to de

Solder balls

Electronics Forum | Fri Nov 15 00:08:01 EST 2019 | ramesh_10377

hi i recommend following actions. 1) check the location where most solder ball is finding 2) verify the printer setting parameter if the problem is still persisting please go below action 1. Stencil thickness should be 4 mil 2. Aperture ope

Ready, Shoot, Aim!!!!

Electronics Forum | Thu Mar 15 22:06:46 EST 2001 | davef

Aw, the internal audit folks just busted us for recurring, potentially ineffective corrective actions on both the quality and safety sides.

Mirror ball

Electronics Forum | Thu Aug 12 04:52:04 EDT 1999 | Omat Marasigan

Hello everyone, I would like to know more about the so called FACETED or "Mirror ball" surface apperance. Its cause and how to eliminate / corrective actions for it. pls. help... thanks and best regargs, ...Omat


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