Electronics Forum | Thu Apr 05 08:44:45 EDT 2007 | ck_the_flip
"Guest" is right, actually. CSP's are essentially BGA's, but typically the pitch and ball diameters are much smaller and in some cases, the pads of the CSP's can not be screen printed. If that's the case, you'd have to have flux-dip capabilities on
Electronics Forum | Tue Jul 06 19:45:03 EDT 2004 | ANDREW
Based on the attchment it looks like both are low profile and cater for high IO point.What are the challenges in running this 2 type of component?Is there any additional process required other than normal SMT for these 2 packages,like underfill ?
Electronics Forum | Fri Apr 06 01:10:16 EDT 2007 | Haris
My SMT line does not has these facilities so would you please tell me regarding the UNDERFILL AND FLUX-DIP process and how they can be done? Thanks.
Electronics Forum | Fri Dec 17 13:23:15 EST 1999 | Chris
I have an underfill material which takes 6 hours to cure. It works great, better than any other underfill I have ever used. A vertical cure oven is too expensive. I am currently using batch style ovens and opening the oven door as additional produ
Electronics Forum | Thu Sep 07 15:24:29 EDT 2000 | Murad Kurwa
Steven, Try http://www.document-center.com/home. You will find various standards for BGAs freely-available but not for free. BTW, I have never seen a BGA underfilled. Only FC and CSPs. The standards available will explain when to.....High CTE delta
Electronics Forum | Mon Jan 17 13:14:48 EST 2005 | GS
Please, can you advice me on the subject. Thanks a lot GS
Electronics Forum | Tue Jan 18 11:18:13 EST 2005 | GS
Thanks Dave, I'll come back. Regards GS
Electronics Forum | Mon Jan 17 14:03:45 EST 2005 | davef
There's a fair amount of information on underfilling CSP and flip chip in the web. Look here to get started: * http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf * http://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID
Electronics Forum | Thu Jul 20 16:15:24 EDT 2000 | Bob Willis
Sorry at the moment I do not have information but as usual I want to get some hands on sessions going. We were doing a flip chip workshop hands on session for Speedline last week in England. We did the theory and then hands on soldering and underfill
Electronics Forum | Fri Jan 30 14:20:55 EST 2009 | scottp
I do a lot of thermal cycle testing of new components for my company and often when I lay out a test board I'm trying to simulate 4 or 6 layer boards but I don't need them for routing so I just use a solid fill of a cross-hatch pattern. I've done it