Inspection and Data Creation Tool for the Stencil / Screen Fabrication Industry. World's leading solder paste stencil & emulsion screen inspection system. Used by both stencil/screen fabricators and users to detect errors BEFORE production, elimina
World's leading solder paste stencil & emulsion screen inspection system. Used by both stencil/screen fabricators and users to detect errors BEFORE production, eliminating costly rework, scrap and delays. Supports E-form, laser cut, chem etch, hybrid
AOI stands for automated optical inspection machine. AOI LSMO was designed and developed specifically for PCB stencil. It helps improve inline PCB assembly quality by reducing screen printing rework rate to 70%. LSMO AOI is the most reliable PCB ste
New Equipment | Assembly Services
Fine Line Stencil is Committed to Delivering the Highest Quality Laser Stencils in the Industry LPKF Laser Technology / SMT Stencil Laser Technology Laser Slic Stencils / Laser Ultra Slic Stencils Custom Apertures Dog Bone, Home Plate, K
Used SMT Equipment | Screen Printers
The MPM Accela printer from Speedline is the ultimate printing solution for manufacturers of high-volume, high-technology applications. Accela processes the largest, thinnest or most complex substrates with unprecedented speed, accuracy and ease. *
Technical Library | 2023-06-12 18:33:29.0
This paper presents a real-time predictive approach to improve solder paste stencil printing cycle decision making process in surface mount assembly lines. Stencil cleaning is a critical process that influences the quality and efficiency of printing circuit board. Stencil cleaning operation depends on various process variables, such as printing speed, printing pressure, and aperture shape. The objective of this research is to help efficiently decide stencil printing cleaning cycle by applying data-driven predictive methods. To predict the printed circuit board quality level, a recurrent neural network (RNN) is applied to obtain the printing performance for the different cleaning aging. In the prediction model, not only the previous printing performance statuses are included, but also the printing settings are used to enhance the RNN learning. The model is tested using data collected from an actual solder paste stencil printing line. Based on the predicted printing performance level, the model can help automatically identify the possible cleaning cycle in practice. The results indicate that the proposed model architecture can predictively provide accurate solder paste printing process information to decision makers and increase the quality of the stencil printing process.
LSMO-105 fastest and most reliable stencil inspection machine www.aoivision.com
Industry Directory | Distributor / Manufacturer
AOI Vision is the specialized supplier of advanced materials and engineering solutions for SMT PCB screen printing industry. We team up with industry leaders who are equipped with cutting edge technology and innovative products.
When time to market is the driving force, fast alternatives to pilot production runs can be the key to success. LPKF UV laser systems provide the flexibility, reliability and high precision that customers demand. By reducing product changeover time
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
