Electronics Forum: aperture shape (Page 2 of 16)

CCGA

Electronics Forum | Sun Apr 03 00:40:35 EST 2005 | Dhanish

What is the recommended stencil aperture opening ,stencil thickness and aperture shape for CCGA?We are seeing high reject for Open solder joint.

LGA Processing

Electronics Forum | Thu Mar 29 21:47:41 EDT 2007 | davef

PCB land to part land ratio - 1:1 Stencil aperture size - 1:1 with PCB land Stencil aperture shape - same as PCB land

solder balls

Electronics Forum | Mon Jul 16 14:48:16 EDT 2001 | mparker

Just received "Circuits Assembly", July 2001 issue. An article regarding solder balls and aperture design, beginning on page 40. This DOE had aperture, reflow profile and no clean pastes (3 types) as attributes. It is advocated that a U-shaped a

solder balls

Electronics Forum | Thu May 06 10:28:27 EDT 2004 | Bryan She

Modify your stencil aperture shape...reduce the solder paste deposited on pad,will reduce the solder balls.Be sure your reflow profile are good before doing this.rising slope is very important. This is my opinion.thanks. Bryan

0201 Land Pattern and Aperture Shape Design

Electronics Forum | Thu Mar 10 07:11:56 EST 2005 | py (france)

Hi, see below.. http://www.omnigraph.com/index1.html?content=/subpages/review.html

Re: SHEESH!

Electronics Forum | Fri Jul 24 01:28:00 EDT 1998 | Alex Ondi

I also heard of a company considering a patent on aperture design. The aperture was a "chevron" aperture, very similar to the "V" shaped aperture recently touted in SMT magazine, presumably for the purpose of reducing solder balls. Go figure!

0201 solder beading

Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake

I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th

Re: Aperture Reduction for QFP (fine pitch)

Electronics Forum | Thu Sep 30 06:47:51 EDT 1999 | park kyung sam

| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | we have placed 16 mil components for 3 years. why don't

Stencil spec software

Electronics Forum | Wed Feb 18 14:45:33 EST 2004 | Mauro Pinheiro

I'm looking for a shareware software that I could use for specifying stencils (we are stencil users not manufacturers). I would like to enter some preliminary spec in a software form, such as: the smallest pad geometry on pcb (possibly selected from

Problems with .45 mil ball diameter BGA....

Electronics Forum | Wed Apr 27 20:55:10 EDT 2005 | KEN

One thing that may have been over looked: Not all solder pastes are created equal. Period. The best way to avoid these situations is to characterize you material (and your process). The fact is you could try every aperture shape under the sun....a


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