Electronics Forum | Thu Apr 12 08:14:43 EDT 2018 | cyber_wolf
The way to determine correct pressure (in my experience) is to start out at what you would consider to be a low sq. pressure setting. You are looking for it to leave a slight film of paste on the stencil. Start increasing pressure in small incremen
Electronics Forum | Tue Sep 28 17:16:55 EDT 1999 | Scott Cook
| There is a company selling pcb with the solder past on the pads and coated with a tacky film to hold the part during assembly. Have you heard of them and can you tell me how to contact them? | Contact Matt Kehoe at 770-475-4576 or 847-740-4120 T
Electronics Forum | Wed Sep 29 16:21:15 EDT 1999 | Mark Quealy
| | There is a company selling pcb with the solder past on the pads and coated with a tacky film to hold the part during assembly. Have you heard of them and can you tell me how to contact them? | | | | Contact Matt Kehoe at 770-475-4576 or 847-740
Electronics Forum | Wed May 07 01:40:41 EDT 2008 | andrzej
What techniques do you use practically to reduce rearmament time of SMT line in high mix production ? There was such post on forum about it but I would like to gather all techniques in one post so everyone can add some ideas which are already applie
Electronics Forum | Wed May 14 09:36:54 EDT 2008 | d0min0
as most of our components are described in AML list, we can't play with that so much... so we focus on preparing the line tools/materials before the change (paste, spatulas, test pcb) - and Yes all the dressing for Juki is ready, for TCM most of the
Electronics Forum | Mon Mar 25 13:48:52 EST 2002 | bcceng
We are currently applying solder bumps to hundreds of BCC's for rework. It is impossible to print to the PWB. It is recommended to apply solder bumps to the BCC's with 63/37 alloy making the rework faster and easier. Applying the solder bump on the
Electronics Forum | Thu Nov 14 11:08:29 EST 2002 | bcceng
Kevin, I have done the following process to a similar problem: 1. Plug holes (even to both sides of the board) 2. Clean any flux left on the surface, especially on bottom side. 3. Apply Kapton tape to the bottom side, you mite want to apply 3 layers
Electronics Forum | Tue Sep 25 09:57:40 EDT 2001 | nwyatt
In regards to your last question, - problem is failures and most think it is due to too much flux - we apply flux with a brush - amount applied depends on the operator applying it - the flux is very thick and will hold the part in place before reflo
Electronics Forum | Mon Oct 06 10:04:29 EDT 2003 | davef
Excess low residue flux is very dangerous to leave on your finished assembly, because it can: * Be corrosive to your solder connections * Promote dendrite growth. To prevent this, follow your supplier's recommendations on: * Applying the proper amou
Electronics Forum | Thu Oct 12 09:48:05 EDT 2000 | John Thorup
Actually they are complimentary. SMOBC describes how the solder mask shall be applied (but not the type, surface finish, color, etc). The other terms describe the type of surface protective finish applied to the solderable surfaces. You need to sp
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