Electronics Forum: bake and vertical (Page 2 of 7)

seperation of soldermask and pcb

Electronics Forum | Tue Mar 25 09:35:28 EDT 2014 | emeto

Have you tried to bake the boards before you process them?

seperation of soldermask and pcb

Electronics Forum | Tue Mar 25 10:31:05 EDT 2014 | sara_pcb

The boards are baked for 2 hours at 120 deg C Regards, R.Saravanan

Soldering robot and solder balls

Electronics Forum | Wed Jun 21 19:01:48 EDT 2017 | mac5

Try baking the boards; you may have a moisture problem.

Cure Ovens and Cycle Interuption

Electronics Forum | Fri Dec 17 13:23:15 EST 1999 | Chris

I have an underfill material which takes 6 hours to cure. It works great, better than any other underfill I have ever used. A vertical cure oven is too expensive. I am currently using batch style ovens and opening the oven door as additional produ

Waffle Tray Handling and Storage

Electronics Forum | Fri Feb 23 08:56:21 EST 2007 | russ

I persoanlly have noticed issue with either method, only time I run into issues with trays is when they get baked at too high of temp and warp. Russ

Water cleaning and Moisture Entrapment

Electronics Forum | Tue Jan 06 14:37:27 EST 2009 | stevek

The easiest way to prove out the absorbtion theory is to weigh the parts before wash, after wash, and after baking. You probably want to do this with the bare parts in isolation as the fab will pick up considerable moisture. Differences in weight s

Water cleaning and Moisture Entrapment

Electronics Forum | Mon Jan 12 02:56:42 EST 2009 | sachu_70

Hi Bill, You should try pre-baking any such old devices prior to using on SMT Reflow. Refering to MSL-type3 guidelines could help in your case.

Solder Splash/Balls and Flux Splash/Balls

Electronics Forum | Fri Dec 11 13:06:54 EST 2020 | johndep7

I haven't, that is a good idea, I was reading about the chance of that earlier but I was not sure. The best way to eliminate is to bake the board?

Solderability of BGA and PCB

Electronics Forum | Mon Nov 20 04:04:42 EST 2000 | Gyver

Sirs, Please do me a favor to answer the following questions, thanks a million! 1. Will the baking of BGA or PCB cause more oxidation before the SMT process? 2. What is the acceptable Life Time of solderability at customer site? The time that the sol

Water cleaning and Moisture Entrapment

Electronics Forum | Mon Dec 29 09:10:22 EST 2008 | stepheniii

It takes time for the moisture to penetrate into the body. I think the 5 years of ambient would be more the culprit than washing the boards. Especially since you are baking them after wash. Get a few of the ICs and put them loose on a board and put


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