Electronics Forum | Sat Dec 19 04:51:49 EST 2015 | padawanlinuxero
bake the pcba, continue with the aqueous cleaning but after the cleaning bake them in a circulated oven. we do that with some of our pcbs here we use a water base flux, we clean it and then we bake them for 10 minutes at 190F
Electronics Forum | Fri May 28 13:19:31 EDT 2021 | cbart
I can't see the image very well, but from what i see it looks like oxidation. looks like an ENIG finish on the board, possibly a plating issue from the bare board house, thin gold or the nickle is to thick. one other question i would get an answer t
Electronics Forum | Sun Feb 03 08:44:25 EST 2002 | davef
There is no standard for baking an assembled board prior to BGA rework, nor should there be. The amount of time required to bake a board varies with: * Board material. * Board construction and layers. * Board size. * Components on the board. If som
Electronics Forum | Tue Apr 23 16:46:14 EDT 2002 | retronix
I would sugest the lowere the baking temperature the better, the main cause of popcorning is the water expansion and this is greatest as the water boils, 100 degrees, better to elongate the time. Matt
Electronics Forum | Sat Mar 06 22:50:48 EST 2004 | pari
Hi, can somebody please educate 1. What is the baking temperature and time before reworking a faulty board that is received from the field. 2. What specs that specifys this baking temp and time? Thanks
Electronics Forum | Thu Nov 03 07:46:07 EDT 2022 | umar
Hi Team Members, I am a PCBA manufacturing assy process, we have a V groove and Hole type panel boards that running at my production side, Any one can advice whether the router machine is suitable for those V groove panel PCBA ? or router only ap
Electronics Forum | Mon Feb 04 12:30:25 EST 2002 | fmonette
Dave highlighted all the elements that must be considered to determine the optimal temperature and duration for a pre-rework PCBA bake process. As far as the component is concerned, it really depends if you care about not damaging the package for r
Electronics Forum | Thu May 31 22:35:23 EDT 2012 | jacktan
I have encountered PCB delam issue with high density PCB. PCB has 42 layers , 5 mm thickness ,laminate material is NelcoN4000-13EP,Tg 210C and Td 350C. Have pre-bake at 125 c for 12 hrs before assy.My reflow temp is standard with 243 peak and TAL is
Electronics Forum | Wed Apr 24 21:35:34 EDT 2002 | davef
Ooooo, much better. Tough to say, because of all the variables [ie, different materials, moisture level, temperature, etc]. Plastic encapsulated devices, especially IC, absorb water from the air, which is violently released during soldering. Typica
Electronics Forum | Tue Apr 23 14:39:49 EDT 2002 | mkallen
Here's a related question: How hot can a PBGA get before popcorn delamination becomes a concern? 100 C? 150C? I realize that the answer will depend upon the conditioning of the part, so let's assume that the part is saturated with moisture. A pra
