Electronics Forum | Wed May 10 00:46:32 EDT 2006 | Chris
I agree! I am using a SAC305 no clean from Alpha. I have noticed that even hand probing with volt meter leads requires me to press very hard on the pads to bust through the flux residue.
Electronics Forum | Tue May 09 14:49:57 EDT 2006 | Larry
Hey guys, Anybody having trouble with increased false contact issues in ICT after switching from lead to lead free? Our test guys keep trying to imply that the flux residues are a problem (we're using Alpha EF2202), but as the soldering process eng
Electronics Forum | Tue May 09 18:00:33 EDT 2006 | russ
in all actuality, you are both right. Alpha metals does have the toughest/hardest noclean residue that I have seen. When changing to no-clean FLUX you should run different probes. So back to square one. You're both right so who's gonna win?
Electronics Forum | Thu Mar 06 03:46:35 EST 2003 | testing
Thanks for the reply Mike, I will look forward to see the end result of your investigation (e-mail people_1@fsmail.net). Regarding the test machines, I was trying to ask what are the suited/or recommended from your experience, set of test equipment
Electronics Forum | Wed Jun 05 17:13:58 EDT 2002 | Yannick
Hello! I have a strage problem, we made some production with uBGA, BGA, 0201, 0805, and other type of component. We didn't put the uBGA and 0201 and BGA on the board at the end of the line we look a our solder joint and surprise the solder made a
Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Wed Jul 05 09:00:13 EDT 2006 | russ
Sounds like possibly too little preheat. Russ
Electronics Forum | Thu Jul 06 12:52:35 EDT 2006 | samir
..and he can put the flux in and keep it a secret too from his customer.. RSS profile on wave?? I never heard of a soak zone for wave preheat...you may be burning off your activator..hence, the beads. For wave preheat, your main goal is to ramp up
Electronics Forum | Mon Jul 03 05:39:05 EDT 2006 | ronalds
Hi, I am experience problems while testing wave soldering SMT components that are glued on the solderside (lead free). Between de leads of SOx type IC's and SOT's develop a great deal of solder beads. I have been using a RSS temp.profile while spr
Electronics Forum | Tue Nov 01 13:35:29 EDT 2011 | jwanderl
With TestJet technology, if we want to test a 64 pin BGA, would we need probe access to each net of the device to get full coverage? If not, would I only get coverage to the pins that have probe access? In a nut shell, How exactly does it work?
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