Electronics Forum | Wed Jul 14 16:59:52 EDT 2010 | swag
Solder paste on the pads will keep part aligned. If you do not use paste, you will need to apply tacky flux. You should not run without one or the other.
Electronics Forum | Fri Jul 23 03:11:50 EDT 2010 | cobar
http://www.shanelo.co.za/SMD%20Assist.htm
Electronics Forum | Fri Mar 18 14:15:35 EDT 2011 | floydf
I found it over here: http://cache.freescale.com/files/archives/doc/app_note/AN1231.pdf?fsrch=1&sr=2
Electronics Forum | Thu Oct 22 11:11:58 EDT 1998 | Hon
Dear all, What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rework on
Electronics Forum | Wed Jun 05 17:13:58 EDT 2002 | Yannick
Hello! I have a strage problem, we made some production with uBGA, BGA, 0201, 0805, and other type of component. We didn't put the uBGA and 0201 and BGA on the board at the end of the line we look a our solder joint and surprise the solder made a
Electronics Forum | Tue Mar 19 17:30:46 EST 2002 | rculpepp
Does anyone have or know of any published guidelines for BGA layout on PWB's so that they can be tested. Specifically using micro vias? If anyone has any input regarding other test considerations for BGA devices I'd like to hear from you as well. W
Electronics Forum | Wed Mar 20 07:57:30 EST 2002 | davef
Purchase: 7095 - Design and Assembly Process Implementation for BGA's Make every effort to distribute the test pads, because if you keep them massed at the ball, it would be a bijundo kick in the BGA rear section, when all of those pins released.
Electronics Forum | Fri Jun 19 09:45:21 EDT 1998 | Mike Cox
Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. Mike
Electronics Forum | Sun Mar 01 14:51:55 EST 1998 | Vincenzo Longobardo
From several months I am investigation about the VOIDS PERSENCE and his important as reliability. One question now is : It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? If you ha
Electronics Forum | Wed Sep 25 13:38:35 EDT 2002 | finepitch
Yannick, If we leave the 201 issue aside; have you checked where those BGA pads are connected to? Could those be power/ground balls connected to large (difficult to heat up) planes by any chance? Erhan
