Electronics Forum | Wed Jul 14 16:59:52 EDT 2010 | swag
Solder paste on the pads will keep part aligned. If you do not use paste, you will need to apply tacky flux. You should not run without one or the other.
Electronics Forum | Fri Jul 23 03:11:50 EDT 2010 | cobar
http://www.shanelo.co.za/SMD%20Assist.htm
Electronics Forum | Fri Mar 18 14:15:35 EDT 2011 | floydf
I found it over here: http://cache.freescale.com/files/archives/doc/app_note/AN1231.pdf?fsrch=1&sr=2
Electronics Forum | Wed Nov 24 16:08:09 EST 2004 | Terrapin Station
This depends on the model. Most machines and turret style typically overstroke .2mm with a force of 250 - 300 grams of force. the reason for the over stroke is to place the component into the paste. This can be adjusted through part library manipul
Electronics Forum | Thu Oct 22 11:11:58 EDT 1998 | Hon
Dear all, What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rework on
Electronics Forum | Tue Oct 13 22:56:22 EDT 2009 | cpcompany
Can anyone help me recommend or simulate a SPI > and AOI machine that can balance our FUJI NXT 1 > with 14 modules. We are using MPM accela printer. > 200 UPH is our target. > > Here's the PCB > dimension > > length(x) = 399.92mm width(y) = >
Electronics Forum | Wed Jun 05 17:13:58 EDT 2002 | Yannick
Hello! I have a strage problem, we made some production with uBGA, BGA, 0201, 0805, and other type of component. We didn't put the uBGA and 0201 and BGA on the board at the end of the line we look a our solder joint and surprise the solder made a
Electronics Forum | Tue Mar 19 17:30:46 EST 2002 | rculpepp
Does anyone have or know of any published guidelines for BGA layout on PWB's so that they can be tested. Specifically using micro vias? If anyone has any input regarding other test considerations for BGA devices I'd like to hear from you as well. W
Electronics Forum | Wed Mar 20 07:57:30 EST 2002 | davef
Purchase: 7095 - Design and Assembly Process Implementation for BGA's Make every effort to distribute the test pads, because if you keep them massed at the ball, it would be a bijundo kick in the BGA rear section, when all of those pins released.
Electronics Forum | Mon Mar 21 09:33:25 EST 2005 | davef
RoHS Substance||RoHS MCV Limits||Typical Testing Approaches Lead||1000 ppm* ||Wet chemical digestion followed by ICP (Inductively coupled plasma) or AAS (atomic absorption) spectroscopy ||||XRF (X-ray fluorescence) spectroscopy Cadmium||100 ppm ||Wet