Electronics Forum | Thu Aug 12 17:15:56 EDT 1999 | Jim Blankenhorn
| I am currently involved with designing a pcb which will use 225 pin bga,s | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | use the middle 6 or 7 rows of balls as the ground
Electronics Forum | Fri Aug 13 04:12:41 EDT 1999 | ray hare
| | I am currently involved with designing a pcb which will use 225 pin bga,s | | The problem with this design is that the components will dissipate a lot of heat and the design we have come up with is | | use the middle 6 or 7 rows of balls as the
Electronics Forum | Thu Jul 17 04:42:47 EDT 2003 | sanjeevc
Hi! One technique: 1. Remove all balls 2.Make > a mask(stensil)for reballing.The holes of the > mask must be 0.8-0.9 the size of the pads. 3. > Reball chips 4. Reflow chips Good luck Hi Yes,we have done quite a bit of reballing of BGAs with
Electronics Forum | Sat Apr 10 10:01:43 EDT 1999 | Jeff Price
| | I am looking for a BGA rework/placement system and would like any experience that you have had. I am looking for a system that is reasonable for the placment, removing and re-balling | | | | thank you | | | -I have had wonderful results with
Electronics Forum | Thu Jul 10 02:49:34 EDT 2003 | emeto
Hi! One technique: 1. Remove all balls 2.Make a mask(stensil)for reballing.The holes of the mask must be 0.8-0.9 the size of the pads. 3. Reball chips 4. Reflow chips Good luck
Electronics Forum | Wed Jul 09 10:55:51 EDT 2003 | Veronica
Hi Reman01, I have done that before when I was in Motorola. What kind of ball are you trying to repair? How many pieces of BGA chip do you need to repair a day? If it is not too many, you can do it by yourself. It is a lot, such as 100 to 1000 piece
Electronics Forum | Mon Jul 07 09:32:28 EDT 2003 | caldon
There are companies that provide technologies to do this: Manncorp has a unit - http://www.manncorp.com/p-m-7500rb.htm and Winslow Automation - http://www.winslowautomation.com and http://www.ape.com/reball_kits.html and companies providing thi
Electronics Forum | Tue Sep 14 14:52:22 EDT 2004 | Carol
During processing, the solder in the vias reflows and forms solder balls. PCBs have solder in random PBGA vias from the board manufacturer.The manufacturer says this is a result of the HASL process and is unavoidable. We use HASL finish, multilayer,
Electronics Forum | Tue Sep 14 19:47:16 EDT 2004 | davef
use something other than HASL. "The rest of the world seems to be processing with no problems..." [Hello!!! Earth to Carol. This is a test.] Things you are considering could be more trouble than they�re worth. "1) Reduce via hole size" [If you re
Electronics Forum | Sat Sep 18 08:26:10 EDT 2004 | davef
Carol: If you would have problems both covering the via and keeping mask from the BGA pads, maybe you via are too close to the pads. Maybe some of the IPC pad design guidelines would help.