Electronics Forum | Mon Aug 11 11:00:40 EDT 2008 | eyalg
RoHS BGA. No lead in it. > RoHS BGA. No lead in it. ok. this is not the case .It was sn/pb type...
Electronics Forum | Mon Aug 11 13:55:09 EDT 2008 | guhansub1
Your defect may be possibly due to black pads, although it is rare on component side. Is your BGA pad finish ENIG? If so, inspection using a SEM can give clues on the presence of black pads
Electronics Forum | Mon Aug 11 14:04:51 EDT 2008 | realchunks
Then your profile is way off. You need a t-couple mounted under the BGA on one of the center balls to measure correctly.
Electronics Forum | Mon Aug 11 10:45:04 EDT 2008 | eyalg
I assume you mean the balls of the BGA, not pads > (laugh it up guys - I said balls). If so, you > may have a no-lead BGA or a high temp BGA. hi I mean that the the balls were left on the board and the BGA pads were found clean. What do you
Electronics Forum | Mon Aug 11 10:47:40 EDT 2008 | dphilbrick
Sounds like bad BGA's to me. I suspect this is rare but you can get black pad on the BGA attach pads just like you get them on a PCB. Do you have un-processed BGA's?(still in package) I would have one tested (not by the manufacturer)!
Electronics Forum | Sat Jun 11 03:26:20 EDT 2016 | nagesh
Hi, I have problem with one of the BGA Top Cap Detached from the Solder Balis attached to the BGA. Advice /Suggest why the Top Cap Has come out. We produced 4150 Pieces & had similar problems with 5 Pieces. Thx in advance for all your suggestions. T
Electronics Forum | Thu Jul 22 21:48:21 EDT 1999 | kyung sam park
Does anyone have any experiences with bga reballing. When I had reworked failed bga part with new part It was good. So I tried to reball bga detached but failed . I guess the cause of fail is thermal shock. IS IT OK TO REBALL BGA PARTS DETACHED ?
Electronics Forum | Thu Jul 22 22:57:14 EDT 1999 | Earl Moon
| Does anyone have any experiences with bga reballing. | When I had reworked failed bga part with new part It was good. | So I tried to reball bga detached but failed . | I guess the cause of fail is thermal shock. | IS IT OK TO REBALL BGA PARTS
Electronics Forum | Mon Jul 26 15:09:31 EDT 1999 | APE South
| Does anyone have any experiences with bga reballing. | When I had reworked failed bga part with new part It was good. | So I tried to reball bga detached but failed . | I guess the cause of fail is thermal shock. | IS IT OK TO REBALL BGA PARTS
Electronics Forum | Sun Jun 12 09:29:41 EDT 2016 | davef
I'd guess that the interconnect pads on the BGA have poor solderability. Confirm this with testing at an independent lab. Work with your supplier to resolve the issue.
