Electronics Forum | Thu Dec 07 14:17:03 EST 2006 | russ
I would bet that it is a SMT adhesive used to ensure that the BGA does not move during a secoindary reflow prcess. this glue is easily removed with a soldering iron. Russ
Electronics Forum | Wed Dec 06 22:35:05 EST 2006 | davef
Questions are: * When you say, "corner of some board's BGA chips", is it on the top of the package or between the board and the bottom of the package? * If between the board and the bottom of the package, does it span the distance between the board a
Electronics Forum | Thu Dec 07 03:21:54 EST 2006 | Guest
Materials you see are corner bond adhesive, main purpose of this is mechanical shock absorber , it promotes additional adhession to lessen stress to solder joints incase device subjected to mechanical stress like dropping.By function, corner bond
Electronics Forum | Wed Dec 06 22:46:39 EST 2006 | SMTrework
Hi Dave, This is manufacturer applied epoxy / adhesive to minimize package "lifing" from chassis flexing and thius board flexing. I have seen the complete array area covered with this black or red epoxy in some cases (i.e. the underfill that I've
Electronics Forum | Thu Dec 07 19:54:55 EST 2006 | davef
We agree with "guest" above. This a "chip bonder" type material used to improve the reliability of array type devices. "A relative comparison of the N50 values is given below: No underfill = 1.0X (baseline) Corner bond = 1.3X Non reworkable underfi
Electronics Forum | Tue May 16 15:53:09 EDT 2006 | Manvendra Verma
What is the solution for removing epoxy on BGA ics?
Electronics Forum | Fri Jun 02 22:46:21 EDT 2006 | mika
Is this the new Xbox 360 You are talking about? So the "modchip" doesn't work? Hmm... Can You please tell us what the purpose of the dissolution of the epoxy on the BGA You would like to do? /
Electronics Forum | Sun May 21 09:38:25 EDT 2006 | davef
Epoxy Removal and IC Delidding [Hardware Hacking: Have Fun While Voiding Your Warranty, Chapter 14] Encapsulation of critical components using epoxy or other adhesives is commonly done to prevent tampering and device access (the microprocessor shown
Electronics Forum | Mon Feb 06 22:45:59 EST 2006 | pyramus
Hi everybody! Just want to ask some recommendation if which epoxy is advisable to be used for bonding and underfill for BGA's at Lead Free Process. Currently, we only used Loctite 3515 for high temp curing for leaded process. How about for Lead fre
Electronics Forum | Thu Oct 13 10:44:18 EDT 2011 | spitkis2
Have you considered adding adhesive / epoxy at the corners of the BGA to secure it in place?
