Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
Electronics Forum | Wed Oct 12 11:08:12 EDT 2005 | Mike
Hly, The solder ball in your picture looks just like the countless BGA solder joints that I�ve produced over the past 8+ years. We've had a good number of these joints X-rayed, cross-sectioned, and thermally stressed. Some say that the stretched loo
Electronics Forum | Tue Sep 07 22:15:26 EDT 1999 | NAZEEH CHAUDRY
| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac
Electronics Forum | Tue Sep 07 06:14:27 EDT 1999 | Earl Moon
| | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | these machines dont even offer bga selections. These machine
Electronics Forum | Tue Sep 07 22:07:56 EDT 1999 | NAZEEH CHAUDRY
| | | I have a zevatech 570 and 560 my boss want to place bga.s with these machines, Ive told him he needs to ugrade to newer machines. Zevatech say "no problem our machine are number 1". | | | these machines dont even offer bga selections. These mac
Electronics Forum | Thu Feb 19 12:52:08 EST 1998 | Earl Moon
| what is your experience about the presence of the voids in the joints ? | Are they dangerous and when ? My specifications require rejection and study if voiding exceeds 2% of solder joint volume measured using x-ray and/or x-sectional analysis. My
Electronics Forum | Tue Oct 11 19:57:04 EDT 2005 | hly
Hi folks, I had posted this earlier but I think there was some confusion on where the wrinkled joints were. The picture is the side view of a BGA soldered onto the PCB. I was able to take this picture becuase the BGA was at the edge of the board. I
Electronics Forum | Mon Feb 01 16:40:45 EST 1999 | Dave Waddick
I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product is
Electronics Forum | Tue Feb 02 12:31:26 EST 1999 | John
| I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product i