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Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.

Nordson ASYMTEK

Conductive Adhesive Dispensing, Process Considerations

Technical Library | 1999-08-27 09:24:56.0

Dispensing conductive adhesives in an automated factory environment creates some special challenges. A robust production process starts with understanding the adhesives in their fluid state and which important parameters must be controlled. Developing this understanding requires experience with a large number of materials and valves over time. Common uses of conductive adhesives in surface mount applications, die attach applications, and gasketing are addressed. As vendors of dispensing equipment, the authors see a constant stream of such applications. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality and speed are given.

Nordson ASYMTEK

Considerations in Dispensing Conformal Coatings

Technical Library | 1999-08-27 09:27:10.0

Conformal coating is a material that is applied to electronic products or assemblies to protect them from solvents, moisture, dust or other contaminants that may cause harm. Coating also prevents dendrite growth, which may result in product failure. This paper will discuss the variables that affect the application of conformal coatings, and review in detail those variables that impact the process of selective coating of printed circuit boards.

Nordson ASYMTEK

PS-900 Value Production Soldering - Single Output

PS-900 Value Production Soldering - Single Output

New Equipment | Rework & Repair Equipment

The PS-900 packs power and provides exceptional thermal control into a small benchtop footprint. Features and Benefits: SmartHeat® temperature control Ergonomic, lightweight handle Rugged cast aluminum housing Added plating thickness to tips

Metcal

MX-5210 Dual Port Simultaneous Soldering and Rework System

MX-5210 Dual Port Simultaneous Soldering and Rework System

New Equipment | Rework & Repair Equipment

New Dual Port Simultaneous Soldering and Rework System highly effective for soldering applications including: lead-free, high mass components or boards, thermally sensitive components requiring low operating temperature, high volume production solder

Metcal

PS-900-SOLAR Solar Soldering System - Tip Hand-piece

PS-900-SOLAR Solar Soldering System - Tip Hand-piece

New Equipment | Rework & Repair Equipment

The need to reduce PV manufacturing costs combined with the present shortage of polysilicon feedstock are driving a steady reduction in wafer and cell thicknesses. The PS-900-Solar Soldering System is the perfect solution Soldering of wires (tabs and

Metcal

MX-5250 Dual Port Simultaneous Desoldering System

MX-5250 Dual Port Simultaneous Desoldering System

New Equipment | Rework & Repair Equipment

New Dual Port Simultaneous Desoldering System designed for plated-through-hole component desoldering. The easy-to-grip handle allows the task to be completed quickly and comfortably. This "shop-air" hand tool, in combination with the new dual simulta

Metcal

HCT2-120 Digital Hot Air Pencil

HCT2-120 Digital Hot Air Pencil

New Equipment | Rework & Repair Equipment

4 layers; or components larger than 5mm2, use of a Metcal preheater (PCT-100 series) may be necessary. FEATURES AND BENEFITS 120 Watt Ceramic Heater and Dual Stage Air Pump: Provides the power and performance needed to deliver the right amount of

Metcal

Metcal’s Paul Wood to Present at IPC APEX 2014

Industry News | 2014-02-21 11:40:56.0

Metcal today announced that Paul Wood will present “Rework Challenges for Smart Phone & Tablets: Do it Right the First Time” during the Rework technical session at IPC APEX EXPO on Wednesday, March 26, 2014 from 1:30-3 p.m. at the Mandalay Bay Convention Center in Las Vegas, NV.

Metcal

Metcal to Bring New Rework Tools to the IPC APEX EXPO

Industry News | 2015-01-20 18:02:54.0

Metcal today announced plans to exhibit in Booth #627 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. The new Metcal Scarab Site Cleaning System (APR-2000-SCS) will be displayed for the first time, along with the new Solder Ball Replacement Kit and MX-HPDC dual cartridge hand-piece.

Metcal


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