Electronics Forum | Fri Oct 06 04:23:06 EDT 2006 | David
What is the solder finish of the board?. If this is gold, maybe you should check the reflow profile and max temperature which can easely kill your gold coating so problems with bonding. Also we are using Prozone Multicore with ultrasonic to clean
Electronics Forum | Thu Nov 03 12:48:14 EST 2005 | Rosewood
We have some no sticks, but that is actually a good thing because we have NSD. During process control audits we found that pull strengths to the board dropped off. We build a military application that requires higher bond strenghts. Low pull streg
Electronics Forum | Mon Sep 09 15:38:02 EDT 2013 | arendonk
Hi, We are having issues aluminum wirebonding on ENEPIG plated PCB by a too low pull force and or having lifts (1% range). Could any body advice how to solve this problem? Is there a special wire bond grade required? How to best clean contaminant
Electronics Forum | Wed Jan 09 17:14:48 EST 2002 | mregalia
Do you bond with Al or gold wire? What happens if the Ni is over 150 microinches? Thickness of nickel is one those things that we have not been consistent with. The industry seems to pretty much universally call for 100-200 microinches. Our old board
Electronics Forum | Thu Oct 05 07:23:34 EDT 2006 | Chris
Hi all experts, I have no background about PCB or SMT process. I am now encountering some issues after SMT - Unstable stitch bonding condition. I am now suspecting some contaminants remain on lead after cleaning. Therefore, how can I check th
Electronics Forum | Thu Nov 03 07:43:52 EST 2005 | davef
Questions are: * Is the problem 'wire bonds that don't stick' or 'wire bonds that fall or break off later'? * What materials are you working with? * What is your working time after plasma clean? * What does surface analysis tell you about surface con
Electronics Forum | Wed Jan 09 17:03:44 EST 2002 | rob_thomas
We follow IPC-2221 recommendations for Au and don't have a problem as long as the Ni is under 150 microinches.This ensures a consistent process for us.Also we do plasma clean after SMt and prior to wirebond.That makes a big difference. Rob
Electronics Forum | Wed Jan 09 18:17:15 EST 2002 | Chris
I don't have a plasma cleaner either. It will help a lot. Actually I don't clean at all. Our wirebond pads are far enough away so the flux residue does not get on the wirebond pads. That's what we think anyway. I am sure we have some degree of c
Electronics Forum | Thu Oct 05 16:04:00 EDT 2006 | GS
I am not expert, just my comment, the total ionic contamination allowed after SMT, by using No Clean process, theoretically it should be close to Zero. Any way the Standard IPC-JSTD-001 allows 1,56 ugr NaCl/cm2 for the final Printed Board assembled.
Electronics Forum | Thu Oct 29 20:19:43 EDT 2009 | 89jeong
Hi. We are doing Au bonding on Al bond pad not Au plated. If pull strength is less than 2.0g, i think that the ball or stich may be lifted from bond pad. And the value become lower after several reflow. I expect that the surface of bond pad may be c
