Electronics Forum | Sat Sep 20 11:24:27 EDT 2003 | Gabriele
Few questions: - wich type of C-CGA ? (CAST or CLASP column to ceramic attach) - column pitch ? - column count ? - capped (with lid) ? or capless (c4 die on top)? - PCB board zize and thickness ? - volume of solder paste ? - Clean or not Clean so
Electronics Forum | Tue Sep 19 18:06:05 EDT 2006 | lheiss
Does anyone know of a source for better documentation for the laser align settings? I managed to get a 1206 ceramic capacitor to measure and was working on a 1206 resistor and couldn't get it to succeed. I retried the cap and it failed again and ag
Electronics Forum | Tue Sep 19 22:55:21 EDT 2006 | darby
Hi Larry, me again. Painting the tip should do diddly because you are using laser. Your cap is probably passing because it's thicker and is just inside the range of the system set-up. Check and calibrate your nozzle alignment height settings. Input t
Electronics Forum | Thu Sep 21 08:06:15 EDT 2006 | bobpan
I think 365 is ok. You should check and make sure the z-rod's spring is ok. Just make sure it is not sticking. Dont waste your money on the pm. If you want a complete list of things to do.....leave an e-mail address and i can e-mail you a list.
Electronics Forum | Tue Jan 14 13:26:28 EST 2014 | emeto
You can also see this: http://www.efd-inc.com/NR/rdonlyres/7C8592BD-70D0-4A0A-91C4-2A2743EB6710/0/EFDFrequentlyAskedQuestions.pdf
Electronics Forum | Fri Sep 23 08:27:28 EDT 2005 | siverts
The 7 spindle Flex jet head, can only pick max 7 comps. from the GSM base machine in a single operation, not from the shuttle. The Flex jet head is faster in z-axis and will also use the OTHC (On The Head Camera) to inspect most of Your smaller comps
Electronics Forum | Mon Mar 27 08:28:48 EST 2000 | Mark Alder
Dear Robert The reason for the bridging problem you are experiencing on your BGA's is due because of too much solder. The PCB pads need to be at least 15% larger than the sphere size of the BGA balls. If you are not using C4 (63/37) BGA spheres and
Electronics Forum | Mon Feb 23 14:52:20 EST 1998 | Igmar
| I am looking for component placer that can handle not only smc but also flip chip C4. | If there is any machine satisfying my request, please inform me. | machine name , spec, and so on. You should definitely consider the "Best-in-Class" SIPLACE
Electronics Forum | Tue Jan 07 17:58:11 EST 2003 | davef
The following book has several chapters on various [ie, flow, no-flow, etc] underfils that could help you: Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John H. Lau; McGraw-Hill Professional; ISBN: 0071351418; 1st edition; 200
Electronics Forum | Sat Sep 20 11:44:39 EDT 2003 | Gabriele
Few questions: - wich type of C-CGA ? (CAST or CLASP column to ceramic attach) - column pitch ? - column count ? - capped (with lid) ? or capless (c4 die on top)? - PCB board zize and thickness ? - PCB copper finisch ? (OSP,HASL, ENIG, etc) - v
