Electronics Forum: cause and of and warpage (Page 2 of 3)

Possibility of a cheaper pick and place machine design?

Electronics Forum | Thu Jul 10 15:12:35 EDT 2014 | alexeis

Hi, Nice idea but it requires care electromagnetic induction. Thus, if a product sensitive electromagnetic field then the solution will cause shorts in a PCB and even disconnect signals. Best Regards, Alexei

Contamination/process issues of SMT and wave soldered pcb's

Electronics Forum | Thu Jul 03 07:59:53 EDT 2003 | loz

OK. Point taken, lets keep this simple then, how about just the issue of under cured solder resist? Any body else encountered such issues. Just feedback, 'cause its something that just seems to have been highlighted to me. Thanks.

Re: Knowledge of Contact 3SX Pick and Place Machine

Electronics Forum | Thu Sep 28 15:57:49 EDT 2000 | Chris

Donna, Please email me at nolefthere@yahoo.com and I will give you my work #. I would like to talk to you on this subject. I have been placing 0402s with a Contact 3AV machine since Nov 96. I have too many suggestions and comments to tell you her

Contamination/process issues of SMT and wave soldered pcb's

Electronics Forum | Thu Jul 03 03:23:04 EDT 2003 | loz

I have been advised recently about pcb manufacturers, that somehow or other supply pcb's with contamination. Visually they are fine, but problems arise during SMT manufacture, ie solder balling, non-wetting on pads, and also during wave solder proces

Re: Pros and Cons of Panasonic MV series chipshooter ?????

Electronics Forum | Tue Sep 15 14:44:01 EDT 1998 | Steve Schrader

| I am thinking of purchasing a Panasonic MV series chipshooter. If you own a Panasonic MV machine I would like to hear what you like and dislike about it. Is the service good? Are spare parts readily availiable? Does Panasonic support and follow up

Ag-plated LED dipping - high level of Cu and Ag

Electronics Forum | Wed Aug 15 16:04:23 EDT 2001 | davef

First, responding to your question � Several things on copper dissolution in solder are: * A 50um copper wire will dissolve in 60Sn / 40Pb solder at: - 200�C solder in 55 seconds; - 250�C solder in 20 seconds; - 300�C solder in 5 seconds; - 350�C so

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 22:59:40 EDT 2005 | davef

We believe your problem is caused by the mismatch in CTE of the material ised in your BGA. In fact, this "potato chipping" [where the corners curl-up] is present in all BGA. The issue is the matter of degree. [Mismatching CTE is how old thermostats

Possibility of a cheaper pick and place machine design?

Electronics Forum | Wed Sep 10 23:06:36 EDT 2014 | andrespena

Sorry 10 days passed before I replied. This happened and that happened and I completely forgot about this forum. But here's my explanation: 1. How to get parts on the board? This is a very good point, and I totally understand why you believe I hav

Rethink of Offshore and Just-in-Time Manufacturing Practices in Light of COVID 19

Electronics Forum | Wed May 06 21:48:41 EDT 2020 | SMTA-Robert

Has the pandemic and the economic fallout from it cause you and your company to rethink your China/Asia outsourcing strategy? Also have your thoughts changed regarding JIT/Kanban/Lean manufacturing practices in view of the present situation?

Need help on assessment of effect of temperature and humidity in battery consumption

Electronics Forum | Tue Apr 24 21:00:58 EDT 2018 | marlonbc

Hi All, Would just like to course through this concern on a product that we are contracted to assemble. It is mainly used for an automatic hand sanitizer dispensing product. By design there is a restrictive value of current that it needs to dissipat


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