Electronics Forum | Thu Mar 31 07:56:31 EST 2005 | cn
I agree with chuck, but would like to add. 2D is a great option and helps to keep your printing process in check, it will measure the x & y coverage on the pad. It will help you determin when your stencil aps become clogged or when the bottom of your
Electronics Forum | Thu Dec 23 09:35:40 EST 1999 | AF Ng
I am looking for a small set of equipment which I can use to perform solder joint reliability test . Could someone provide supplier contacts. The equipment should be able to provide temperature cycling capability. Thank you
Electronics Forum | Mon Dec 27 12:48:27 EST 1999 | jacob lacourse
Vi technology presents a great seminar that i attended a few months ago this company is out of mass. but they travel all over to give this presentation. the seminar is to inform you about different inspection machines it is not commercial at all.
Electronics Forum | Tue Feb 22 08:40:12 EST 2005 | JB
A couple of features on your stencil printer that should help with a couple of potential printing processes: A temperature control unit and the automatic understencil cleaning with the chemical of your choice. That alone, will reduce the chances of
Electronics Forum | Wed Mar 30 08:06:17 EST 2005 | davef
Considerations are: * If the nonwetting is component lot specific, the could be solderability issues with that lot. * If the nonwetting is is a broader based component issue, the solderability protection on the component may require a different reflo
Electronics Forum | Mon Jun 12 22:11:11 EDT 2006 | danielchankh
Is there anyone out there who has used fringe pattern image projection vs laser triangulation method for solder paste volume inspection? Need some advice on which is better?
Electronics Forum | Sat Feb 19 09:26:19 EST 2005 | davef
Your customer asks a reasonable question. How do you know that your: * Paste has not dried? * Stencil aperatures have not become clogged? * On and on ... Some agrue that printing is the most critical process and that it drives all down-stream failu
Electronics Forum | Wed Mar 30 01:01:10 EST 2005 | vicknesh28
All, Has there been any finding from the component point of view in terms of non wets after reflow and if yes, can anyone share what was improved on the component to reduce the non wet defective levels. What would be the contribution from the compon
Electronics Forum | Mon Feb 21 04:04:21 EST 2005 | abhirami
1.67 always on the sample boards measured. This is very fast and pretty good measurement for a paste dispense control. Boards do not stand out-side for long times. Inspect the height for critical components only, in the initial stages. Once your Cpk
Electronics Forum | Tue Feb 22 07:58:16 EST 2005 | davef
We hear you. If it's not broken, why fix it? Right? Well intentioned, but not very educated customers seems to be part of the bane of existance of process engineers at contractors. First, as a previous poster said, paste height is an improper mea