Electronics Forum: chip and capacitor and weights (Page 2 of 2)

Yestech B3 Capacitors and P+P downtime

Electronics Forum | Thu Apr 07 09:24:47 EDT 2011 | rway

What version of sw are you running? There are some new features in 2.7.7 and earlier that may be of benefit to you. With chip caps you are testing for presense/absense. The gain/offset feature can be used to give you better contrast between the pa

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 14:52:16 EDT 1998 | Gary Simbulan

| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef

Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept

Re: wave soldering surface mount tantalum and ceramic capacitors

Electronics Forum | Fri Feb 05 09:39:58 EST 1999 | Dave F

| Can anyone help me with the pros and cons of trying to wave | solder tantalum and large (1812) ceramic capacitors. I do | know that one may see fractures on larger cermaic caps, but have not seen much on the tantalums. Any insight as to what proble

Re: wave soldering surface mount tantalum and ceramic capacitors

Electronics Forum | Tue Feb 16 16:28:30 EST 1999 | Tuffty

| | Can anyone help me with the pros and cons of trying to wave | | solder tantalum and large (1812) ceramic capacitors. I do | | know that one may see fractures on larger cermaic caps, but have not seen much on the tantalums. Any insight as to what

cap size and copper thickness vs part size questions

Electronics Forum | Mon Nov 07 11:26:23 EST 2005 | CW

How large of chip capacitor can we use reliably? I��ve heard they tend to crack. I��ve also heard if you pre heat the larger chip caps (1812 and above) before vapor phase reflow, they won��t crack. If I use 2 mil copper for a power supply board, a

cap size and copper thickness vs part size questions

Electronics Forum | Mon Nov 07 16:34:55 EST 2005 | CW

If I am putting chip capacitors on a .063 FR4 board, what size package should we stay away from to avoid cracking? If I use 2 mil copper on the outside layers of a PCB, am I limited to what pitch of parts I can use? Specifically, will using 0603

cap size and copper thickness vs part size questions

Electronics Forum | Mon Nov 07 16:31:47 EST 2005 | CW

hi Bob, Thanks for the info. I understand your comments, but I am looking for specific guidance, If I am putting chip capacitors on a .063 FR4 board, what size package should we stay away from to avoid cracking? (I realize this is dependent on h

cap size and copper thickness vs part size questions

Electronics Forum | Tue Nov 08 05:00:23 EST 2005 | rlackey

Hi CW, Regarding orientation, yes, your diagram is right - see the following link for confirmation. http://search.murata.co.jp/Ceramy/image/img/A18X/C2EB3C.PDF Regarding information on bending strength you want to talk to your local Murata office

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