Electronics Forum: clear and alarms (Page 2 of 8)

QFN's and LGA's

Electronics Forum | Tue May 26 14:39:40 EDT 2009 | boloxis

QFN or MLFs are mainstream now, QFNs already evloved to much more complex versions now like matrix pins, stacked dice and flipchip versions. IPC 610D already includes them, just make sure the pins have solder plating, the PWB pads have soldermask in

Circuit cam and mydata

Electronics Forum | Fri Apr 10 09:59:13 EDT 2020 | spoiltforchoice

&gt; We unfortunately use GERBER data to digitize <BR> &gt; boards more than any CAD. We are CM and many of <BR> &gt; our customers do not provide CAD. With some <BR> &gt; Legacy products, we still use 274-D Gerbers

MPM Up2000 and SMEMA

Electronics Forum | Tue Sep 20 15:00:26 EDT 2016 | awhite

Got it!!!!! On the main Operator Screen for the MPM UP2000, and under configuration (when logged-in under maintenance), it gives you ONLY the settings that the machine is set to....there are no drop-downs or options available to choose from. Very fr

CIM systems and Final Assembly

Electronics Forum | Tue Jan 23 10:43:52 EST 2001 | marys

What recommendations do you have for evaluating the needs of a company in terms of this kind of software and needed hardware? What software do you recommend? Is there data available that clearly demonstrates the advantages of adopting a system like

Re: solder balls and flux

Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F

Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is

Re: solder balls and flux

Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F

Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is

Bow and twist of PCB's

Electronics Forum | Mon Apr 23 11:44:55 EDT 2001 | CAL

650 Standards are also located in the back of IPC JSTD-001. I am currently looking at 4 pages on bow and twist. Percent bow = R1-R2/L x 100 (R1= Highest point; R2=lowest or resting point; l= length) Percent twist=(R1-R2)/(2xL)x 100 Sorry if this is

CSM-84 pick and place machine.

Electronics Forum | Tue Feb 15 00:27:39 EST 2011 | jeffr

First clean and de-bur the hole in the nozzle, then try it again. If the Head does not pick up at the feeder, then moves to the dump position...it means that the Vacuum Sensor Board has detected that the nozzle vacuum is above the LOW threshold setti

New Pick and Place Operation

Electronics Forum | Tue Jan 17 12:25:56 EST 2006 | Cmiller

Pete C, this forum has no value if people do not share thier real world experience. We can all do research on our own. We can all make bad decisions or good decisions based on that research because most of the data we have access to comes from the pe

Re: Geometric Dimensioning and Tolerancing

Electronics Forum | Sun Jun 07 02:06:26 EDT 1998 | Earl Moon

| Earl, | As always, I am interested in what you have to say, but I am still a little vague on your application of ANSI Y14.5 as it relates to the manufacturability of an assembled printed circuit board. Are you implying that component placement coor


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