Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.
Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process
Electronics Forum | Fri Jan 15 14:49:32 EST 1999 | Dave F
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Wed Jun 30 18:36:21 EDT 1999 | Mark
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Mon Jul 26 14:58:52 EDT 2004 | cisridn
I am new to the No-Clean Process. When preforming rework in a No-Clean Process, should the rework technician clean the excess flux used to change a component or place a component missing?
Electronics Forum | Fri May 12 08:54:05 EDT 2006 | Rob
Remember, the components' bodies are not going to like the elevated temperatures - you may want to trial a few before you expend too much effort on preforms.
Electronics Forum | Wed Feb 21 11:53:42 EST 2007 | SMTRework
Hi Russ, Thanks for the suggestion. I have the practical components sets that you mentioned, they take too long to do 10 pcs, the "pre-forms" are much faster. What equipment do you use for your automated process?
Electronics Forum | Fri Jun 10 23:24:02 EDT 2022 | llawrence
Ah okay, that should be pretty easy to do on the current board design. If overprinting doesn't work, then I might try a preform. I wasn't even aware that was a thing, I might be able to do some of our through-hole components that way if they are rate
Electronics Forum | Wed Apr 28 06:26:15 EDT 2021 | jeremy_leaf
@Evtimov I can't use flux as the components being soldered can't cope with any contamination whatsoever. Even an ultra low solids no-clean flux will be too much. I also can't clean the boards after soldering due to any residual contamination from the
Electronics Forum | Thu Aug 12 19:30:22 EDT 1999 | Kris Harris
| We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave or
Electronics Forum | Mon Aug 26 20:33:50 EDT 2002 | davef
Not as such. Generally, people tailor their profiles to produce glam solder connections on their boards. Search the fine SMTnet Archives for discussion on the factors affecting solder reflow recipes. What is the best way to get these PCB made to s
.gif)
