Electronics Forum | Tue May 26 11:13:49 EDT 2009 | xinxi
Is the components on the top or on the bottom of the pcb? Have you checked whether the temperature on pcb are too high when it pass through SW that it exceeds the limit that the components can take? Do check with the component manufacture for the te
Electronics Forum | Tue Apr 24 21:12:32 EDT 2001 | davef
I prefer mine skewered with a remoulade, yum. IPC-A-610 allows component side overhang to the lesser of either up to 25% of the component termination width or up to 25% of the width of the pad for Class 3 devices. Help us understand your problem.
Electronics Forum | Tue May 26 10:23:53 EDT 2009 | mun4o
hi, i am proccess eng solder wave process.I have problem with a PCB.There have ceramic SMD capacitor, SMD thermistor and SMD inductor 1uH.After reflow all is OK, but after SW these components are broken???The pin is separated from the body???the que
Electronics Forum | Mon Jan 18 06:31:27 EST 1999 | Marcus Wagner
Hi, I�m searching for manufactores of lead-free components (resistance, capacitors ...) Do you know adresses, websides ... to get some information? Please tell me.
Electronics Forum | Mon Sep 26 07:56:38 EDT 2005 | pavel_murtishev
Hi! Try to make "R_AXIS_ACCURACY" calibration for all of FNC heads for back camera only. I met such problem on Topaz-X. There was clearly seen offset on 0.8mm pitch components. I simply calibrated all cameras for FNC nozzles and problem disappeared.
Electronics Forum | Thu Mar 22 11:23:42 EDT 2007 | Stefan
Hi, Can somebody tell if for melf components the x and z sizes are the same? Normally they are, but the machine's vision system sees only 60-70% of the x size due to light dispersion. The Z dimension has to be the one measured with a vernier caliper?
Electronics Forum | Fri Mar 23 07:17:50 EDT 2007 | Phil J
Stefan The Z hight required for a MELF will depend on the design of nozzle used on your machine. If it has a "V" tip you should measure the hight of the component on a nozzle then subtract the nozzle hight.
Electronics Forum | Wed May 27 07:02:34 EDT 2009 | xinxi
Have you tried profiling the board with temperature label or profiler thru wave? I reckon your pre-heat temperature might be too high either on top or bottom and cause the component to expand unevenly. Regards, xinxi
Electronics Forum | Fri May 29 02:02:07 EDT 2009 | cobar
The problem could be that the preheat temp of the PCB is too low on entering the bath.Also look at moisture ingression of components.Have a look at solder Assit at http://www.shanelo.co.za
Electronics Forum | Mon May 10 20:46:25 EDT 2004 | davef
The three basic methods you can use to restore solderability on components are: * Highly active fluxes in a retinning operation. * Surface stripping chemistry and then a standard retinning operation. * Electrochemical conversion chemistry and then a
