Electronics Forum: contaminated leads that cause poor wetting (Page 2 of 10)

Porosity in Good Plating

Electronics Forum | Fri Jul 04 12:32:33 EDT 2003 | sam

I need some advice about a problem that happened in a SMT LED: The failure symphoms of this SMT LEDs is that the LED body itself seemed to be functional, but when soldering on the products, it showed good wetting and soldering, LEDs are bright and l

solder defect

Electronics Forum | Sun Sep 22 23:23:39 EDT 2019 | sssamw

Yes, no wetting on the several leads, to verify is same location of the leads? Looks PCB/IC leads wetting issue, a process contaminated or raw material issue. A cross experiments to verify the potential cause is needed.

solder fillet peeling

Electronics Forum | Thu Jul 03 07:43:50 EDT 2003 | davef

So, there is a crack or gap between: * Solder and component termination. * Component termination and component body. Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the terminatio

SMT Component Design Requirements

Electronics Forum | Fri Oct 18 17:47:37 EDT 2002 | russ

What is the determination of poor soldering fails pull test, non-wetting, visual)? I have never heard of an SMT component that has leads higher than the body of the component. Refer to IPC 782 3.6.1.7 it provide the guidelines for SMT standoff heig

Re: Solder joint criteria

Electronics Forum | Tue May 30 21:06:57 EDT 2000 | Dave F

Thames: Welcome. Consider Rev C. It's current and has "better" descriptions. Consider a course. I believe IPC is doing a tourof A-610 and J-001 classes. Different problems have different root causes. For instance: * Cold solder: Moving the c

BGA dropping off the board

Electronics Forum | Mon Feb 18 02:08:06 EST 2008 | lococost

4 days seems a lot. You could be losing flux activation causing poor wetting on the enig. Check your suppliers data sheets for paste life. If it was contamination on the PCB, you'ld expect other components to solder badly as well. Try using a bra

Re: no-clean process / Got Dendritus Eh?

Electronics Forum | Thu Sep 24 10:19:55 EDT 1998 | Dave F

| i am working on a no-clean process implementation project in a company. i want to change a board to no-clean which had dendrite problems underneath the small resistors on the bottom side(in smt).i want more information on the exact cause of dendrit

Re: Good Solder Joint Failures

Electronics Forum | Mon Feb 15 17:57:01 EST 1999 | Earl Moon

| Hope some of you out there can help me with this one. | I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they

potted components-reflow soldering

Electronics Forum | Mon Feb 02 05:08:37 EST 2004 | heccles

Anybody seen problems with potted trimpots and reflow soldering - specifically poor wetting as a consequence of lead contamination from the potting compound. Regardless of reflow profile used (MIL -STD -202) cannot get a good joint formed ! If you us

What caused this reflow issue?

Electronics Forum | Tue Apr 15 21:24:41 EDT 2008 | davef

We find it curious that: * Heat slug pad for Q19 didn't take solder, indicating a pad [board] solderability issue. * Signal termination pads for Q19 didn't flow well, indicating a poor thermal recipe or a pad [board] solderability issue. * Signal ter


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