Electronics Forum | Mon Jul 24 15:10:37 EDT 2006 | carln
Here are some additional comments that have been posted on the CircuitNet web site: Fist, the answer is the same regardless of the specific paste type, (leaded or non-leaded). High pressure sprays should never be applied to a stencil. Stencils are
Electronics Forum | Tue Sep 22 10:52:31 EDT 1998 | Wayne Bracy
| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material
Electronics Forum | Thu Mar 18 12:32:16 EST 2004 | steve_arneson
There are many low cost paste inspection systems on the market today. It really depends upon your overall needs for process improvement. The CyberOptics LSM series of inspection devices use a single laser stripe to calculate both Height, Area and V
Electronics Forum | Fri Apr 30 13:26:10 EDT 2021 | amaliahx
The pandemic has altered people's habits, causing a surge in demand for home electronic devices. This has swept the global chip supply and disrupted automobile manufacturing. The pandemic has led to the global shortage of semiconductors or chips, and
Electronics Forum | Thu Jan 14 15:22:14 EST 1999 | Earl Moon
| Steve, | Whoa, take a breath! That was at least a dollar three-eighty answer. I've got to agree that nothing can replace a qualified, concientious operator for assuring quality. When I too worked at a small shop there in SillyCone Valley, my
Electronics Forum | Mon Aug 17 02:57:47 EDT 1998 | Bob Willis
| | Looking for Suppliers of surface mount wetting balance equipment. | Bucky: Section 6 of the ANSI/J-STD-002 specification lists wetting balance suppliers. Dave F I like and continue to use the Multicore system. I have had many ours using the sys
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
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