Electronics Forum | Fri Mar 21 08:56:29 EST 2003 | russ
Is it possible that the flux you used, if applied in excess could have caused the balls to "blow out". I have seen this in the past and it was related to the type of flux we were using and the amount. Russ
Electronics Forum | Sat Mar 22 01:05:47 EST 2003 | bcceng
I agree with Russ, seen this happen if the right amount of paste flux is not applied. You mite want to dip the spheres of the BGA to the layer of paste flux.
Electronics Forum | Thu Feb 20 17:18:24 EST 2003 | davef
Give us infortmation, please. What is [are]: * Height board to board side of the interposer on the low side of uBGA * Height board to board side of the interposer on the high side of uBGA * Alloy of solder balls, no paste was used correct? * Type of
Electronics Forum | Wed Dec 27 21:12:30 EST 2000 | Dave F
From a process perspective, I don�t know if you should be concerned ... You've told us nothing about your process. THE BOOK JEDEC MO-51 allows 6 thou warp in smaller [1mm pitch] BGA and 8 thou in larger [ 1.27mm and 1.5mm pitch] BGA. The increase
Electronics Forum | Mon Mar 24 08:57:20 EST 2003 | russ
I don't know if I would call it a "blow hole". what I believe happens (I don't have a camera to watch spheres during the reflow process) is that when the flux starts heating up, expansion, bubbling, or something physically displaces the balls. We fo
Electronics Forum | Wed Mar 10 08:19:01 EST 2010 | aajmera
We have these standard pitch QFPs, for which we found some coplanarity error issues. The issues surfaced during BLT. We do not have any instrument to measure the coplanarity error before the component is loaded on the placement machines. Is there any
Electronics Forum | Sat Oct 25 18:46:39 EDT 2003 | Gabriele
JEDEC Standards allows max 4 mils lead coplanarity Gabe
Electronics Forum | Sun Mar 20 19:26:02 EST 2005 | devilhitam
Thanks pmd for input. The main concern here, was there any standard document regarding this coplanarity check were implemented?
Electronics Forum | Fri Mar 18 03:53:16 EST 2005 | devilhitam
hi guys, I need a help here. Does anyone know what is the standard for coplanarity check for fine pitch IC that well practiced? I am using SIEMENS F5 for fine pitch IC placement.SIEMENS F5 do have the capability for coplanarity check. My customer re
Electronics Forum | Fri Oct 24 13:41:39 EDT 2003 | albertoh
I need some information about coplanarity specs for QFP's. I try to setup coplanarity inspection on my QP242 but i'm not sure about what value i need on each parameter in order to setup my diferents parts data for this option. Thanks in advance.
