Electronics Forum: copper foil reflow (Page 2 of 51)

Reducing Warp after reflow

Electronics Forum | Thu Oct 13 21:43:47 EDT 2022 | sarason

If you are running resonable volumes of the board, redesign it with equal copper on both sides. One way of achieving this is to just run copper flood planes on both sides of the board, this is a fairly common technique in RF and noise sensitive analo

Reducing Warp after reflow

Electronics Forum | Thu Oct 13 16:08:37 EDT 2022 | proy

No we can't change any of the copper, and that I believe is likley the primary cause of the warp

BGA reflow on bottomside

Electronics Forum | Tue Nov 20 09:50:07 EST 2007 | rgduval

Only on the bottom side? Run that side first . We usually determine our run process based on the heaviest components, and propensity for falling off during the second reflow process. If there's only the one BGA on that side of the board, we'd tend

Reducing Warp after reflow

Electronics Forum | Wed Oct 19 06:46:27 EDT 2022 | winston_one

What about warpage before reflow? Often the boards with unbalanced copper can be warped initially, and you can reject it... If it's not possible to change the copper, then may be (at least for future lots) it's possible to switch to laminate with hi

reflow / soldering temperature

Electronics Forum | Thu Apr 05 10:50:08 EDT 2001 | CAL

Per our staff here at ACI......... Higher Temperatures maybe necessary to achieve good solder process results. The alloy formed when HASL coating protects the copper is the same as that when OSP provide protection. Temperatures may be increased to im

Reducing Warp after reflow

Electronics Forum | Thu Oct 13 15:38:18 EDT 2022 | proceng1

Do you have the ability to add copper thieving or otherwise balance the design? We had a customer making LED boards with a terible inbalance. Some of the boards would "smile" so badly in the oven that the leading edge touched the top. They switche

reflow / soldering temperature

Electronics Forum | Thu Apr 05 08:36:35 EDT 2001 | jmlasserre

use a solder join temperature of 200/210� whatever the pcb used (tin lead coated or osp or gold fash). 2nd ==> to adapt the temerature to the pcb used: - Reflow (200-210�) for tin lead coated pcb's (in this case we have just to reflow the solder

Reducing Warp after reflow

Electronics Forum | Wed Oct 19 14:03:47 EDT 2022 | proceng1

Low Temp solder and a cooler profile should certainly help. I do believe that the unbalanced copper is the culprit, but you could try to prebake some boards. To eliminate some kind of manufacturing defect from the equation. Though I'm pretty sure i

Reducing Warp after reflow

Electronics Forum | Wed Oct 19 14:15:43 EDT 2022 | proy

Thank you all a but the easy fix - of correcting copper - is not an option -actually no changes to the board can be done simply they way it is.... I will look at post reflow bake above TG but I don't want to add a process.... Will look at profile als

Modems reflow mistake

Electronics Forum | Mon Oct 12 10:26:52 EDT 2015 | eniac

My greetings to all. Time to time I receive the next results of modems soldering: http://i.piccy.info/i9/71ae4c358c6e4bc3f1cbf140495bc437/1444660170/135005/872954/GL868_7.jpg or http://i.piccy.info/i9/d1181be142e285a39b49b81d37bde72a/1444660270/1


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