Electronics Forum | Tue Nov 11 17:35:08 EST 2008 | davef
SM-840, is a material qualification document only, with all the test requirements applicable only to a defined test coupon, not to production boards. So, it's useless for what you're trying to accomplish. As assemblers use A-610 - Acceptability Of E
Electronics Forum | Sat Feb 14 08:21:13 EST 2009 | davef
We believe that it's perfectly resonable for you to define the cleanliness that you require. We recommend that you leave it at that and not define the process or materials that your supplier use in meeting that cleanliness level. Start with a dirty
Electronics Forum | Wed Mar 22 12:53:43 EST 2000 | David Spilker
Be careful if you use Ni/Au. The "black pad" phenomenum can be crippling. We moved from Ni/Au to OSP because of it. I also don't want to return to the lack of flatness of HASL.
Electronics Forum | Wed Mar 22 12:53:43 EST 2000 | David Spilker
Be careful if you use Ni/Au. The "black pad" phenomenum can be crippling. We moved from Ni/Au to OSP because of it. I also don't want to return to the lack of flatness of HASL.
Electronics Forum | Mon Jul 20 17:04:44 EDT 1998 | Richard Jackson
Can someone point me to where I can get a copy of the spec for these finishes. Thanks Richard Jackson richardj@tanisys.com Jackson_Richard@csi.com
Electronics Forum | Tue Jun 13 08:33:11 EDT 2006 | davef
IPC-2222, 5.3.1 defines the parameters of making scoring cuts and the tolerance of the cuts, but does not specify the cuts. Our spec for 0.062" thick FR-4 boards is: 0.018-0.024"
Electronics Forum | Tue Jan 23 06:16:13 EST 2007 | Ayelet
Hi, I am lookinh for standards that define the cleanliness level of the assembly room and also for the test and packaging room. I understand that tehre are some defintions of tempertaure and humidity that shoudl be met. Are there any specs for part
Electronics Forum | Fri Feb 06 03:56:47 EST 2004 | JaMi Smith
BGAs and QFPs packaged in Trays are oriented with Pin 1 or corner A1 oriented towards the Pin 1 identifier on one corner of the Tray, which is usually identified by a chamfered corner. The Trays themselves are usually governed by JEDEC Registered Ou
Electronics Forum | Wed Jun 03 10:09:39 EDT 1998 | Robert Horowitz
My name is Robert Horowitz with Contact Systems. We meet all the specs. you defined including Bar Code reading of both boards and components. Please call me at (203) 743-3837 for more information. Regards, Robert Horowitz Sales Manager Contact Syste
Electronics Forum | Thu Jul 11 20:36:43 EDT 2002 | cyber_wolf
It will place BGA's, but you will be centering by using the part outline. The IP2 cannot be adapted to do individual ball inspection.(You may already know this) As far as getting the part to stay on the part shuttle, I am sure that there is somethin
