Electronics Forum: delamination and under and component (Page 2 of 5)

Conformal Coat and RTV

Electronics Forum | Wed Jan 03 21:20:22 EST 2007 | davef

Comments are: * General purpose RTV (RTV-108) releases an acetic acid (vinegar) during cure and corrodes copper, brass and sensitive metals. It is therefore NOT for use in delicate electrical or electronic applications. However, there is an electrica

Cleaning Machine and Chemistry

Electronics Forum | Mon Feb 19 11:36:39 EST 2001 | billschreiber

Hello Mark, I wish it were that simple so I could direct you to a particular manufacturer and stencil cleaner model. Unfortunately, there are several issues complicating the process of cleaning all these applications in one machine. First and fore

BGA rework and inspection

Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied

Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar

Dye and Pry on PoPs?

Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman

Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also

Water wash flux and cleaning

Electronics Forum | Mon Jun 19 09:47:23 EDT 2017 | georgetruitt

You have a lot to think about! What does the flux manufacturer recommend as far as specifics like water temp or pressure? Do they recommend high temp di-water a detergent or saponifier? Do you currently have a cleaning machine, batch cleaner or inl

Solder Balls and conformal coating

Electronics Forum | Mon Apr 08 14:16:29 EDT 2019 | sever_83

We've never heard of seen of such a thing either. We tried a clean sample board and applied con coat. Same process through out and we saw nothing. After speaking with the original operators who was curing the boards he had left the boards much longer

BGA and QFP orientation in trays for pick and place

Electronics Forum | Fri Feb 06 03:56:47 EST 2004 | JaMi Smith

BGAs and QFPs packaged in Trays are oriented with Pin 1 or corner A1 oriented towards the Pin 1 identifier on one corner of the Tray, which is usually identified by a chamfered corner. The Trays themselves are usually governed by JEDEC Registered Ou

wave soldering and solder bridge

Electronics Forum | Mon Dec 17 11:55:08 EST 2007 | chef

I recently had the same problems, solder bridges on every thing I made, different customers boards, etc. I wave with no-clean flux. As I sorted out problems (pin holes, blow holes, splatter, etc.) I found a lot of variable factors. I changed flux,

Cleaning under, around, and through tight spaces

Electronics Forum | Tue Jan 05 15:36:53 EST 1999 | Earl Moon

A question for you all! Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clean under 20 mil pitch

Processing questions - PCB and BGA's

Electronics Forum | Fri Jan 30 10:29:48 EST 2009 | petep

We have a potential new customer who has special PCB requirements. I do not know a lot of details at this point, but have several questions. One of their assemblies has within it , a MID, Solid foil layer, completely isolating one side of the PCB f


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