Electronics Forum | Wed Jul 25 11:55:21 EDT 2007 | ck_the_flip
Zoinks!! Doing the homeplate design on 0402 will actually make your tombstones WORSE! Think about it. Your wetting forces are now on the ENDS of the device with no solder paste toward the middle of the device to tack the part down - a gauranteed f
Electronics Forum | Thu Sep 17 15:21:50 EDT 2020 | lpbro
For height, I start +-2mil usually. For 3mil stencils, my lower limit starts at 1.5mil, upper is 5. If the area is chem ethed, I normally add .5 to the stencil height. My default volume is 60 - 160%. Then print specs are adjusted till I see fit, then
Electronics Forum | Wed Jul 25 13:05:59 EDT 2007 | ck_the_flip
Here is a good article: http://www.emasiamag.com/article-669-stencildesignforleadfreesmtassembly-Asia.html
Electronics Forum | Fri Sep 18 01:34:58 EDT 2020 | SMTA-64386317
Thank you for your input.
Electronics Forum | Thu Feb 12 21:06:20 EST 2004 | davef
"LGA" [land grid array] is a pretty broad topic. Search the fine SMTnet Archives for background on: * BGA * uBGA * Flip chip * etc Consider: * Area Array Packaging Handbook: Manufacturing and Assembly; Ken Gilleo; McGraw-Hill Professional; 1st edit
Electronics Forum | Sat Dec 16 09:42:41 EST 2006 | Frank
Hi all, Having been designing (3d modelling and programming) stencils and tooling (solderwave carriers,print support etc) for several years I am now investigating whether it would be possible to do this from home. I live in the UK and am therefo
Electronics Forum | Tue Feb 17 11:36:33 EST 2004 | POC
Try Amkor web page here http://www.amkor.com/products/notes_papers/appnotes_LGA_0902.pdf Regards POC
Electronics Forum | Mon Feb 29 23:41:09 EST 2016 | padawanlinuxero
Is more a guess but, your drawing is missing things, more precise the legends on the edge of the drawing, but for what I can see the diameter of the ball is 0.30 +- 0.05 hope it helps!
Electronics Forum | Thu Sep 17 03:36:47 EDT 2020 | SMTA-64386317
Hi All, Is there any specific control for solder height and volume? Such as 3 mil what will be the height and volume upper and lower limit?
Electronics Forum | Fri Mar 02 00:21:38 EST 2007 | AMS
Hello, I havea 0.4mm pitch TQFP with heat transfer pad on the bottom side of component. I will appreciate any suggestions with regards to: 1) stencil thickness (Rest of components on board are 0603 passives and few 40 mil pitch IC's) 2) Stencil
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