Electronics Forum: design manufacturing (Page 2 of 96)

Low capacity PCB manufacturing equipment

Electronics Forum | Fri Jul 23 04:29:38 EDT 1999 | MK

Can anybody recommend low capacity PCB manufacturing equipment for labaratory or research/designers center. Output 2-10 sqr. m. per shift; required working space 30-100 sqr. m. Spent too much time looking fr this. Thanks in advance.

stencil to pcb manufacturing tolerance

Electronics Forum | Fri Oct 31 06:55:35 EDT 2008 | andrzej

Answer on point 2 - I understand you send him gerbers of single PCB (?). In most cases you have panelized PCBs so to avoid problems with stencil first you should order PCBs and ASK your PCB supplier to send you back his gerbers of panel. There are so

stencil to pcb manufacturing tolerance

Electronics Forum | Thu Oct 30 09:15:20 EDT 2008 | kingshar

Hi, Hi, 1) Can anyone tell be what is the acceptable manufacturing tolerance from stencil to PCB . 2) what are the methods we can avoid that. 3) What is the method to avoid PCB shrinkage. 4) How can we correct shrinkage 5)Is there any standard gud

Land pattern design

Electronics Forum | Tue Oct 30 08:48:01 EST 2001 | dougie

Hi, Our PCB designers are beginning to send up designs to manufacturing that have increasingly difficult footprints to work with. The footprints have been generated by the IPC-SM-782 calculator but just look wrong to me. The pitch of the devices in

design rule checks

Electronics Forum | Wed Nov 29 10:31:19 EST 2006 | dougs

Hi, Just wondering what, if any, design rule checks each of you do prior to running new products. Comments from contract manufacturers particularly welcome. regards Dougs

Nordic aQFN73 stencil design

Electronics Forum | Mon Apr 09 12:52:00 EDT 2018 | slthomas

We are about to do a second iteration of something we struggled mightily with last time and I'm hoping to at least make a step in the right direction. There are 12 of these parts on the board and virtually all of them required removal and replacemen

Nordic aQFN73 stencil design

Electronics Forum | Mon Apr 09 16:00:46 EDT 2018 | slthomas

Yes. I'm at a loss as to how to best approach this. I think the giant blob of solder is just going to behave more like a lubricant than anything else. The thing is, I would like to at least try the manufacturer's recommendation once (and this bui

stencil design software

Electronics Forum | Fri May 17 11:36:37 EDT 2002 | Hussman69

Hmmm... Why would you want to to this? I understand your concern, but why not let your stencil house manipulate your Gerber and send you a copy of it before they cut a stencil? Saves you time and money. Sit down with your stencil manufacturer and

Nordic aQFN73 stencil design

Electronics Forum | Tue Apr 10 08:37:36 EDT 2018 | davef

Hi Steve ... I found nothing in the manufacturers "paper" to help. Comments are: * I agree. No blobs. Solder on the thermal pad should me minimized. Too much solder will float the component. Old timers used to talk about 50-80% coverage. * If you'

Re: BGA design Guidelines

Electronics Forum | Thu Mar 09 05:44:07 EST 2000 | Wolfgang Busko

Hi Edmund, J-STD-013 "IMPLEMENTATION of BALL GRID ARRAY and other HIGH DENSITY TECHNOLOGY" should be a great help for you. Component manufacturers ( try Motorola via Internet) also give good advice. For the DFM aspects get in contact with your asse


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