Electronics Forum | Fri Sep 21 10:35:37 EDT 2012 | davef
Flash gold is just thin electrolytic gold plating over electroless nickel or electrolytic nickel. Flash gold plating ... * Less than 3 microinch thick will be porous and take solder poorly * Greater than 10 microinch thick will cause brittle solder c
Electronics Forum | Tue Nov 28 17:23:03 EST 2006 | flipit
Flash gold usually refers to electrolytic gold with a short plating time. In other words gold plating that requires current to plate. If you have bare copper under your soldermask, the gold is probably ENIG. The only other way to have bare copper
Electronics Forum | Tue May 01 20:36:03 EDT 2001 | davef
Sorry to disappoint, bud. Believe it or not, this guy's for real. It'll be sad when his investors find out that returns on contacting are something akin to pass book accounts. I'd do something like the prank that you imply, but this is a lame topi
Electronics Forum | Thu Jan 09 15:19:41 EST 2014 | davef
For a typical wear surface application [millions of wipes], I agree with hege. You need to be talking electrolytic gold, NOT immersion gold. IPC-2221 says something like ... For edge connectors and areas not to be soldered: * Nickel - 2.5um [~100uin]
Electronics Forum | Fri Mar 24 18:07:25 EST 2006 | Chris
Flash gold is just thin gold plating over electroless nickel or electrolytic nickel. Flash gold is electrolytic gold where the panel is connected to a plating rectifier and current causes the plating process to occur. Gold thickness is controlled b
Electronics Forum | Wed Sep 10 02:47:49 EDT 2003 | Dennis O'Donnelll
This is a problem of contamination in the plating bath. Most prominent with white tin and some gold over nickel plating processes. Rather than argue with your vendor over the issue, and to avoid future recurring problems, I use either HASL or elect
Electronics Forum | Mon Feb 09 16:55:28 EST 2009 | cuperpeter
Hi Sachin, thanks for your feedback. According to our supplier, surface plating is electrolytic gold over Nickel(not ENIG), but I think that is a still improper thickness for Au. (according to 3rd Working Draft from September 2008 of IPC 2221B "0.4
Electronics Forum | Wed Dec 14 07:34:33 EST 2005 | davef
Mike Ozzy If I came to your house, I wouldn't punch you. I'd make you buy me beer. Vern Solberg; Tessera Technologies Inc., 3099 Orchard Dr, San Jose, CA 95134; 408 568 3734 F408 894 0768 vsolberg at tessera dot com. If that doesn't work try: Tes
Electronics Forum | Tue Oct 19 05:46:45 EDT 2010 | hhpcb
IR reflow bottom side-> COB Will 2 times IR reflow affect COB bonding process? Appreciate any kind of feedback from you guys..
Electronics Forum | Fri Oct 22 10:41:08 EDT 2010 | janz
hi 1) just run test batch and pull test wire. Use MIL std to find out your results. 2) again run through and test wire.
