Electronics Forum | Thu Jul 06 20:46:17 EDT 2000 | Dave F
Mark: An area of increasing interest to all of us. From the SMTnet "Terms & Definitions" (or whatever they call it) Globtop. Encapsulant. Encapsulating. Encapsulation. Potting. Enclosing an article in an envelope of adhesive or encapsulating co
Electronics Forum | Mon Aug 06 16:08:57 EDT 2001 | seand
Hello Again John, Are you injecting a like material currently? How are you doing this with your current process? Is this material being used specifically because the customer identified it as such? If this is not a current process for you, how do
Electronics Forum | Sat Jun 22 21:06:27 EDT 2002 | jersbo
I agree with PJC.. The mention of 2 QFPs to wave = more than likely rework to remove bridges and a potential to scrap the board, 25mil isnt as bad as 20 or less.. but the potential is still very real.$$$$$$ reflow/reflow is my 2 cents with the possib
Electronics Forum | Fri Jun 25 11:29:43 EDT 2004 | tcp
We have had some field returns of a double sided SMT board manufactured in the February timeframe. The boards are encapsulated in an epoxy potting. When removing the potting some SSOP devices came off in the potting. The leads had pulled out of th
Electronics Forum | Fri Nov 16 03:38:03 EST 2018 | premkumar_haribabu
Hi all, We have to solder a nickel tabs ( coming in SMT reels ) in to HASL PCB finish pads using refow oven & during this we facing poor wetting issues, more voids & we done pull strenth , its came out with in 1 kg ,I doubt that nickel coated materi
Electronics Forum | Tue Nov 07 08:01:10 EST 2006 | davef
We/ve never heard of "glass wicking failure" in regards to board fab. Boat fab, yes. Look here: http://www.boatdesign.net/forums/showthread.php?t=13321 Barrel cracking appears after thermal stress during soldering, because epoxy expands in the "z"
Electronics Forum | Thu Nov 22 12:56:12 EST 2001 | tony_sauve
Thanks for the comments & suggestions. Here's some info garnered from a telecon w/the PCB Fab house: -the blind via's extend from layer 2-17...this was a revelation. The info from our customer was that the via's only extended down 2 layers. Did I men
Electronics Forum | Mon Mar 07 10:14:31 EST 2005 | jmedernach
Cellular and PDA architectures employ this technology all the time. You have to be careful with your board supplier as well as with your plugging approach. Leave the via unplugged, I guarantee voids in the solder joint. That leaves us with, "how d
Electronics Forum | Wed Oct 25 12:24:02 EDT 2000 | Philip
Hi Chris! I hope this will help you! The CBGA uses an array of high melting point solder spheres(Sn10/Pb90) to connect its ceramic chip carrier to an epoxy glass (FR4) PCB using eutectic (Sn63/Pb37) solder joints at both ceramic and card inter
Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis
Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in
