Electronics Forum | Fri Nov 22 08:59:49 EST 2002 | ksfacinelli
I would have to agree with the to high temp being a real problem. I have seen this with the WS-609 alpha paste. If you run it up to high in temp. The joints appear to be cold but they are really just over fried.....definitely try reducing temperat
Electronics Forum | Tue Dec 10 22:18:32 EST 2002 | davef
Randy's correct. If you were soldering to nickel with WS609, you would be complaining about non-wetting, not lumpy solder flow.
Electronics Forum | Wed Apr 02 10:51:17 EST 2003 | kmorris
Myu: Did you have to change your reflow profiles when you changed from 609 to 709? What ramp rate & time over liquidus are your profiles at?
Electronics Forum | Fri Jul 23 09:17:16 EDT 2004 | davef
The more we think about this, the more we think you should join the 20th century and upgrade from your good ol' WS609. We know this will be tough. We used the stuff for 10s of years.
Electronics Forum | Mon Jan 21 16:13:50 EST 2008 | arun2382
We see delamination at Mold compound to substrate interface when tested for MSL3. We haven't tested the substrate for cleanliness. Can you please suggest methods for this? thanks, arun
Electronics Forum | Mon Feb 04 07:43:02 EST 2008 | davef
Bruce: We know Arun is not cleaning the board properly. Arun does not know how to determine if the board is clean. Arun doesn't know how long to clean the board. Apparently, you do. Tell Arun the answers.
Electronics Forum | Wed Jun 15 10:38:41 EDT 2016 | laynefelix
Hi everyone..i am new here. I am hardware design engineer and as per my experience PCBAs came out cold soldered after being reflowed the first time with ALPHA WS-820. The flux gel ALPHA WS 609 was supposed to be applied only onto the terminations of
Electronics Forum | Thu Jun 25 20:26:37 EDT 1998 | Chiakl
| I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everythi
Electronics Forum | Tue Jun 30 11:51:41 EDT 1998 | Michael Fogel
| | I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everyt
Electronics Forum | Thu Jul 02 19:18:31 EDT 1998 | Rin
| | | | I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. E
