Electronics Forum | Tue Oct 07 02:18:13 EDT 2003 | iman
Hi Experts, Pls help advise what is the expected range of PCB gold thickness over Ni (for ENIG/Electrolytic fabrication processes)? any referrence standards set by the IPC?
Electronics Forum | Tue May 31 10:58:31 EDT 2005 | davef
There are a host of possibilities. Virtually any fabrication process prior to outer layer manufacturing prior to HAL could contribute to dewetting. That goes all the way to excessive brighteners in the copper plating line. Anything that prevents the
Electronics Forum | Mon Jun 02 15:09:10 EDT 2014 | davef
I've never heard of anyone affected by thiourea during assembly soldering operations. I believe the greatest concern of exposure to thiourea is during the board fabrication process. BR ... davef
Electronics Forum | Thu Jul 23 07:17:22 EDT 2009 | davef
Things that define the expected product from a board fabricator are: * Fabricator's standard process capability statement. * Buyer's purchase document. * Purchase agreement.
Electronics Forum | Fri Oct 13 15:22:57 EDT 2000 | Dave F
Talk more about your CEM board fabrication and assembly processes, please.
Electronics Forum | Tue Aug 23 09:53:05 EDT 2005 | davef
There's some good background information on SIR [surface insulation resistance] on the web. Here's an example: http://www.tracelabs.com/TechLibraryDoc.aspx?id=4 Look to IPC-9201 - Surface Insulation Resistance Handbook SIR readings vary with: * C
Electronics Forum | Tue Aug 10 09:01:18 EDT 2010 | davef
No, warpage tells you that design and/or fabrication process and/or assembly process need[s] to be corrected. Here's a link to a recent thread on SMTnet that seems to answer some of your questions: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Mess
Electronics Forum | Tue Dec 07 10:57:29 EST 2010 | davef
Warpage tells you that design and/or fabrication process and/or assembly process need[s] to be corrected. Here's a link to a recent thread on SMTnet that seems to answer some of your questions: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_I
Electronics Forum | Tue Apr 09 16:31:49 EDT 2013 | alfredodsanchez
Hello everyone! I have a problem with PCB, we detect that some contamiation apear (dark spots similar to glue or underfill) we detect that this element is Policarbonate. I don't know if on PCB fabrication process some policarbonate are used. We alr
Electronics Forum | Thu May 09 17:21:39 EDT 2002 | davef
In describing a bare board, you need to talk about base, laminate, and conductive materials. Common laminate materials are: * Glass fabric * Cotton fabric * Paper Common NEMA grades of technical laminates are: * Glass Fabric Grades: G3, G7, G10,