Electronics Forum | Mon Aug 19 23:12:24 EDT 2002 | jason
Hi Andy, Do u also face tombstoning and cold joints when using Ag immersion pcbs ???
Electronics Forum | Mon Nov 26 20:05:52 EST 2007 | shy
Hi Real Chunks, kindly help to elaborate more on the potential problem that i will face?
Electronics Forum | Wed May 16 14:44:25 EDT 2012 | davef
WML ... Where have you been? We haven't had smiles on our faces, since you left.
Electronics Forum | Fri Aug 30 04:45:41 EDT 2013 | anilw2006
Need to change CPU card HIMV-134. I had facing same problem. Regards, Anil Wagh.
Electronics Forum | Fri Oct 23 00:34:13 EDT 2015 | nhel_0009
The board that facing to the front..its on the left side sir..thanos again.
Electronics Forum | Wed Apr 07 10:35:28 EDT 2021 | micropak
What problem you are facing with F5 ?
Electronics Forum | Thu Feb 08 16:39:18 EST 2024 | dharmendra
You face this types issue before.
Electronics Forum | Thu Jul 20 12:11:28 EDT 2000 | Mike McMonagle
There are many challenges facing the assembly industry today such as: - Lead-free assembly and other environmental concerns - Continued shrinkage of active and discrete components - �New� alternate fab finishes such as immersion tin and silver - The
Electronics Forum | Thu Jan 09 06:44:38 EST 2003 | ldzaugis
One shop picked up productivity with walkmen. The hand assemblers were jammed in tight and frequently face to face. It cut down conversation significantly and reduced complaints about music in general. The policy was eventually changed to only one he
Electronics Forum | Fri Jul 30 00:21:01 EDT 2004 | Jet
Hi, Very interesting article on tombstone issue, i'm facing tombstone issue for 0805 IDC component, i've redesign the stencil aperture and change to lead free paste, the tombstone is reducing but not fully eliminated, however there is a problem i fa
