Electronics Forum | Tue Jul 25 11:30:47 EDT 2006 | DC
Russ, we had similiar issue on the corner seperation. The board is ENIG and the part is Altera FBGA 1020 (Super BGA) and reflowed by tin/lead paste. Please comment your concern on Altera parts! Is CTE mismatch?
Electronics Forum | Fri Aug 10 18:31:10 EDT 2018 | ks0707
Absolutely I will share the solution with you if I find something. Thomas, thank you for your help. Have a great weekend!
Electronics Forum | Mon May 12 09:36:05 EDT 2008 | radab
Hi, I have some BGA devices, a plastic FBGA memory chip (to be replaced) and an exposed-die FBGA processor here which need reworking. I picked up an Aoyue hot air rework station (http://www.aoyue.com/en/ArticleShow.asp?ArticleID=383) along with the
Electronics Forum | Wed Jul 09 15:54:51 EDT 2003 | Louis
I need advice from someone who has already soldered this part or similar fine-pitch BGA with metal heatsink on top Should I solder it in the oven or it's better with a rework station (IR 550A Ersascope) Thanks All
Electronics Forum | Thu Jul 10 15:05:30 EDT 2003 | stepheno
Don't forget about moisture sensitive devices already on the board if you are reflowing the entire board again. No doubt the other BGA's have been absorbing moisture since the boards were first reflowed. You may have to bake the boards before reflo
Electronics Forum | Thu Sep 07 07:36:57 EDT 2017 | tsvetan
we use 0.12 mm stencil with 0.3 mm apretures for 0.5mm step FBGA153 memory without problems the solder paste is SAC305 Class4 http://www.olimex.com/Products/Components/Soldering/SOLDER-PASTE-SAC305-CLASS4/
Electronics Forum | Fri Aug 10 18:17:43 EDT 2018 | tey422
I am sorry to hear that they are unable to help you out too. If you do came up with the doable solution later, be sure to let me know about it too. I would like to learn new trick or knowing which house that can handle such task.
Electronics Forum | Thu Jul 10 15:00:58 EDT 2003 | russ
Louis, For whatever it is worth, When I have $5000 parts I don't even mess around with a rework station. I would mask off any heat sensitive components (We use water soluble masking like that for wave soldering) and then process through the oven yo
Electronics Forum | Tue Mar 02 10:19:41 EST 2004 | loz
Hi all, we have recently seen a design that consists off a QFP100, pitch at 25". Also in the centre of this footprint is a FBGA165 footprint, pad size .4mm @ 1mm pitch. We have been informed that we will fit the QFP. I want to remove the BGA pads fr
Electronics Forum | Thu Mar 04 18:48:17 EST 2004 | Roger
Hi Robert, We've been using a SmartSonic cleaning system for years. We place a lot of 0402's and FBGA components. The system cleans those apertures very effectively. The chemistry used in the cleaning solution is very safe and environmentally fri
