Electronics Forum | Fri Oct 17 16:31:53 EDT 2014 | dyoungquist
Per IPC-A-610D: Target is 100% vertical fill but 75% vertical fill is acceptable for Class 1,2,3. Only needing 75% fill of the barrel when soldering plate through on an 0.093" thick board with our selective solder has been a life saver at times.
Electronics Forum | Mon Mar 04 17:52:59 EST 2002 | davef
Yes, providing the surface of the via is solderable. * If so, how much paste? => Vias come in various sizes. Boards vary in thickness. So, the amount of paste to fill a via varies. Roughly, you�ll need twice as much paste as the volume of the via
Electronics Forum | Wed Dec 18 09:04:29 EST 2002 | russ
Dave, You stated that an unfilled via is of greater strength than a filled or partially filled via. I posted to another thread recently and I stated that a filled via was of greater strength than an unfilled. I was tought (incorrectly?) that a fill
Electronics Forum | Tue Jun 20 21:30:05 EDT 2006 | davef
The minimum vertical hole fill is defined as follows: Class 1: Not specified, with a 270-degree circumferential fillet and wetting on the secondary (solder source side) of lead and barrel, and a 75% coverage of the land area on the secondary side. Cl
Electronics Forum | Fri Oct 12 12:12:13 EDT 2018 | davidsmullins
We have some fairly standard 0.1" pitch, two row, shrouded, through hole headers soldered onto a thick backplane. There are tiny inspection holes along the bottom edge of the plastic body that allow an inspector to observe the top of the through hole
Electronics Forum | Fri Nov 30 12:21:26 EST 2018 | davef
Three things ... 1. Since you are soldering a component over a hole that limits the possibility that the hole could be filled with solder, it makes me wonder if the hole is supposed to be filled with solder. What do the engineering notes say? 2. Ta
Electronics Forum | Wed Apr 05 13:00:27 EDT 2000 | mike d
Hi guys, Anyone have any good ideas on how to fill up idle surface mount machine time? We are currently between projects and have idle time which I need to fill. Any good tips would be greatly appreciated. Thanks, Mike D.
Electronics Forum | Fri Apr 05 11:18:20 EST 2002 | habs24
Anyone have experience using Dupont CB100 for high aspect ratio via fills? Or even where I could get more information on the processes involved? Thanks in advance...
Electronics Forum | Wed Oct 23 09:41:49 EDT 2002 | Antonio
Can anyone give me a ran down process on CSP? Is it like BGA process that needs reflow? what oven do I need...vapor, nitrogen or convection? is under fill a necessity? when and why do i have to under fill? when not to underfill and why? etc.... than