Electronics Forum | Fri Sep 13 18:01:39 EDT 2002 | dbonilla
Do you know what will be the best solder process for pins at the edge of the ceramic substrate? Thanks
Electronics Forum | Sun Sep 15 09:13:41 EDT 2002 | davef
A near eutechtic alloy [ie, 63/37, 62/36/2, etc] would be fine. People print, place, and reflow millions of cermaic capacitors with these alloys every day.
Electronics Forum | Mon Sep 16 08:24:07 EDT 2002 | dbonilla
Stefano: Yes I do. May you let me know more about the dedicated technology? Regards david
Electronics Forum | Mon Sep 16 03:10:32 EDT 2002 | stefano_bolleri
Do you mean, rows of pins at the edge of the substrate, making it a SIP/DIP component? This is achieved by attaching leadframes with dedicated technology, and is a typical high-volume application. If you confirm this is what you are looking for, ther
Electronics Forum | Mon Aug 16 04:31:15 EDT 2021 | bme57
Hi. I am looking for a printer that can print a conductive circuit on a thin film, like polyester or mylar film. Any lead would be appreciated. Thanks, bme
Electronics Forum | Thu Aug 23 20:56:08 EDT 2001 | davef
Print paste on tempered glass, place the parts, and reflow. What's the story?
Electronics Forum | Thu Apr 27 02:39:50 EDT 2017 | ajaytyagi
Thanks for sharing your experience. I have similar view too.
Electronics Forum | Wed Apr 26 06:09:12 EDT 2017 | ajaytyagi
Hi, Pl let me know about opinion/experience whether thick film chip SMD resistor which is MSL-1 Required to bake before being usedon SMT line. I want to use SMD resistance spool which is around 2 yeasr old kept at 25 deg room temperature at around 4
Electronics Forum | Wed Aug 25 00:10:13 EDT 2021 | sarason
The company that does this is McDermid. There are multiple different ways of doing it. Screen print silver paste onto the mylar, "activate" the film to be conductive, then plate in copper. These processes are found in the patent literature which is e
Electronics Forum | Mon Aug 27 10:58:44 EDT 2001 | Ryan Jennens
Steve- We had the same trouble with 0805 Panasonic film caps. We had some tombstoning and open solder joints (non-wetting). We found two problems...like you, we changed our pad design to meet their recommendation. Also, they were able to suppl
