Electronics Forum: flip-chip (Page 2 of 30)

Flip Chip with Siplace F 3

Electronics Forum | Thu May 25 08:18:19 EDT 2000 | Mulitze

Has anyone experience in placing Flip-Chips (Pad-Size: 120x120um) with an Siplace F 3?

flip chip tolerances

Electronics Forum | Fri Jun 01 14:50:29 EDT 2001 | Matt Gormont

I am looking for outline tolerances of a flip chip with a pitch of .25mm. Bumps are made of 63/37 solder. Key tolerances are bump height and positional tolerance of the bumps. Can anyone HELP?

Dummy Flip Chips - Supplier Needed

Electronics Forum | Tue Dec 21 10:27:12 EST 1999 | Aaron Unterborn

Looking for mechanical chips (daisy-chained / stiched) for flip chip (C4) testing. Any contacts or suppliers? Thanks.

Re: Dummy Flip Chips - Supplier Needed

Electronics Forum | Tue Dec 21 15:27:01 EST 1999 | John Thorup

The 2000 Top Line catalog list about 10 types of flip chips and are available daisy chained. 714/898-3830 Practical components also lists several 714/899-8309 They both have test boards as well. John Thorup

flip chip bonder

Electronics Forum | Wed Sep 23 20:38:30 EDT 1998 | parag

does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap.

Flip chips - need info on handling and packaging

Electronics Forum | Tue Jun 16 16:03:52 EDT 1998 | Diane Rogers

Does anyone have experience working with flip chips? I would like to know how to work with them, some precautions, inspection techniques, etc. Thanks! Diane...

flux dispensing vs flux dipping for Flip Chip

Electronics Forum | Thu Apr 09 12:13:22 EDT 1998 | raymond

What is the pro & con of using flux dispensing vs flux dipping method for flip chip assembly ?

Flip chip placer

Electronics Forum | Fri Feb 20 20:08:18 EST 1998 | Chang Woo Cho

I am looking for component placer that can handle not only smc but also flip chip C4. If there is any machine satisfying my request, please inform me. machine name , spec, and so on.

ACF Process

Electronics Forum | Sun Dec 23 08:41:04 EST 2001 | dwoon

Does anyone has experience in ACF (anisotropic conductive film) process? What is the typical bonding pressure/force/temperature for FCOG (flip chip on glass)? Will the glass crack when a high pressure applied during flip chip placement? Thanks and

Flip Chip assembly without underfill

Electronics Forum | Mon Jan 06 11:23:30 EST 2003 | emeto

Hi all, Can anyone give me more info about Flip Chip assembly without underfill.Some technics,necessary equipment(optics,linear motors,accuracy and so on)or where i can read about it.


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