Electronics Forum: flux exhaust (Page 2 of 7)

oven resin from adhesives

Electronics Forum | Tue Aug 13 16:47:22 EDT 2002 | mick

The residues are from the flux, not adhesive. Do you have flux management system in oven? You also need to check the flux type = can you use low solids. The effect is the same as steam in bathroom - it is cooling affects in exhaust and flux reforming

Oven profiles. Linear vs. Saddle?

Electronics Forum | Fri Oct 10 20:56:50 EDT 2014 | jlawson

Main issues... Pad Design Thermal Mismatch Design related to pads effected Moisture and out gassing in substrate / part terminations can move parts slightly during preheat prior to liquidous this get position shift ( smaller the parts more an issue)

Spray Fluxer Problem

Electronics Forum | Thu May 07 08:12:06 EDT 2009 | milroy

Hi I recommend you to check the exhaust sensor, the ERSA EWS500F is sensing the exhaust before it activates the fluxer. If the exhaust is not working then machine does not start to avoid the sprayed flux emit to the work environment. There is a sens

Re: Flux Residue in Oven Vents

Electronics Forum | Mon Jan 18 17:58:09 EST 1999 | marc p

| I have a severe problem with flux residue being drawn up the vent ducts of my reflow oven. This residue reaches a critical mass then begins to flow down the ducts and becomes very messy. I run a no-clean process and use IR oven. Has anyone else o

Dealing with TH Barrels on Bds w/Heavy Ground Planes

Electronics Forum | Thu Oct 16 11:15:53 EDT 2008 | davef

A good solder connection with heavy ground plane requires: * Plenty of heat [Is the preheater located too far from the wave? Whenever you look at board temperature, there is a sharp decrease in temperature between the preheater and the wave.] * Conta

HIP defect in BGA

Electronics Forum | Mon Jun 15 06:21:13 EDT 2020 | ameenullakhan

Hi Team, Main reason for HIP are; 1. Warpage in component or PCB : Verified the part and PCB 1.6 mm thickness no warpage found. 2. Hip was at different locations : center as well as corner : So not because of warpage of component. 3.Solder paste equ

How to identify any Vibration Source in Reflow Oven

Electronics Forum | Mon Aug 05 17:50:20 EDT 2019 | travishemen

We have a Rehm oven that can vibrate hard enough to shift parts on the board. The vibration is due to flux build up on the exhaust blower. If we don't clean it regularly we start to see parts shifting in the oven.

Halogen-free Solder Re-flow Quality Issues

Electronics Forum | Fri Sep 04 04:39:08 EDT 2015 | grahamcooper22

Maybe look at reducing the time above liquidus to @ 60 seconds. HF materials tend to want tighter reflow profiles...halogen activators are great at higher temps and longer reflow profiles..but HF prefer shorter profiles. The HF pictures look like the

Flux on the body of SMT components

Electronics Forum | Wed Feb 28 19:34:34 EST 2024 | tey422

I have seen there is flux like stuff dripping off from the exhaust area of the reflow oven onto the board That would be the issue of poor maintenance.

Re: Reflow Profile Dry Out Stage

Electronics Forum | Wed Dec 13 18:41:33 EST 2000 | Steve A

Chris, I am not a chemist, but my best guess would be that you were able to remove some of the solvents from the paste flux without exhausting too much of the activators. The loss of solvents could have cut down on violent boiling (violent boiling


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