Electronics Forum | Thu Sep 09 12:56:39 EDT 2021 | emeto
Thank you for your reply Djo. What do you consider a normal range tension for 29" stencil on a hard frame? Also I am not sure how I can use micrometer in the middle of 29" stencil to measure the thickness? CAn you please clarify?
Electronics Forum | Sat Sep 24 16:06:13 EDT 2011 | tech1
Okay so you are picking from a Wafer Frame and it is a UV cured tape. Who's die sorting machine are you using? You mention the ejector needles, but have you checked them? What size are the die and how thick are they? Have you checked the UV cure, i
Electronics Forum | Wed Jan 21 10:41:57 EST 2004 | davef
Depending on how you frame the question, either of you could be correct. Neither of you mentioned stencil thickness, which together with aperture opening [and stencil fabrication technology] define how well a paste will release. So, the key measure
Electronics Forum | Wed Jan 29 10:25:23 EST 2020 | dontfeedphils
VG foils are about 5mm thick and two in the rack takes up just under 20mm, so admittedly not a ton of space savings. That's not the only reason I like the VG system though. It takes multiple failure points (screen tension/mesh adhesion) and reduces
Electronics Forum | Tue Apr 27 13:41:16 EDT 1999 | Scott McKee
| i am trying to design a stencil fixture for manual printing. has anyone done this before or has an idea? thanks | There are sooo many variables; product size, 1 vs. 2 sided boards, support, component size, pitch, stencil alignment, PCB thickness,
Electronics Forum | Sun Mar 07 13:10:15 EST 1999 | Sam Sangani
| Has anyone used the mechanical stencil foil tensioning system from certain company that eliminates using stencil frames and epoxy & mesh? Any comments on whether it's worth looking into? We go through product revisions like we go through clean so
Electronics Forum | Thu Oct 08 22:20:44 EDT 1998 | Dave F
| | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the rema
Electronics Forum | Fri Oct 09 04:08:45 EDT 1998 | Thomas Blesinger
| | | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the re
Electronics Forum | Tue Jun 29 13:42:20 EDT 2004 | sigmaprint
You will need to set the contact and squeegee zero calibration every time you set up a new product, we do this because the thickness of the substrate (pcb) can change between product and this will effect these calibration settings. The machine does n
Electronics Forum | Mon Oct 25 11:15:10 EDT 2004 | davef
We assume by "stencil tension" you mean a measurement of how securely [or how tauntly] the stencil foil is held in the stencil frame. If so, we do not know how you would go about making your "30 ~ 50 N/cm" limit measurement when verifying conformanc
