Electronics Forum | Sat Feb 28 08:15:50 EST 2004 | davef
J-STD-001 has what you need. 3.6 Facilities ......................... 4 3.6.1 Environmental Controls ........... 4 3.6.2 Temperature and Humidity ......... 4 3.6.3 Lighting ......................... 4 3.6.4 Field Assembly Operations ........ 4 3.6.5
Electronics Forum | Wed Jun 07 22:33:50 EDT 2006 | Bolos
first: what is your problem after reflow? second: a good rule of thumb is a tolerance of 1 mil. for example..if you got 5 thou stencil thickness then your range of thickness is 6-/+1 thou.. then you just improve after you get your height data and ana
Electronics Forum | Wed Jul 12 08:57:58 EDT 2006 | Evamaria
Mike , Look at http://www.circuittechctr.com, Guidebook, section 6,6.1. This method of attaching jumper wires is in accordance to the acceptability criteria of IPC-A-610 section 11.2.4.3. You did not specify what wire AWG is. I am assuming it is sma
Electronics Forum | Sat Nov 11 22:43:50 EST 2006 | KEN
Hey Sr. Tech. Before you get crazy with changing the process or chemistry I would first verify you are using the correct mix ratio. A refractometer can be a useful tool in these cases. I have seen this in the past where the maintenance technician
Electronics Forum | Wed Jul 18 11:49:59 EDT 2007 | davef
The auditor may be using "verify" in an ESD Program context. See ANSI/ESD S20.20 [1999], 6.1.3, Compliance Verification Plan. It gives one definition of what the auditor may be seeking. For more on verification programs, look here: http://www.protek
Electronics Forum | Sun Jun 29 10:55:00 EDT 2014 | mario85
Hi Everyone I'm new here. I am looking for a FLEXA 4.6.1 software. I have to refresh my knowledge of programming. Does anybody have this software? I'm also looking for some kind of tutorial regarding creating new programs from the scratch. Maybe the
Electronics Forum | Wed Dec 11 07:05:28 EST 2019 | ameenullakhan
Hi, Below may help you out. per IPC 7093 ( Design and assembly Process Implementation for Bottom Termination Components ),Clause 6.1.5.3 voids on thermal pad up to 50% does not result in loss of thermal performance. Since the void criteria is
Electronics Forum | Tue Mar 09 12:13:27 EST 2004 | Gabriele
I want just to confirm what Dave suggested you. J-STD-033a, par 6. Boards Rework tells you plenty of useful informations. 6.1 Component removal, RWK and remount 6.1.1 Removal for Failure Analysi 6.1.2 Removal & Remount 6.2 Baking of Populated Boar
Electronics Forum | Fri Mar 22 17:14:15 EST 2002 | jseagle
What is the height, width, and length of the connector, packaging? We currently place a 2x20 2mm gull wing SMT connector measuring 8mm H x 38mm L x 6.1mm W, packaged on tape and reel with a plastic pickup in the center. We do this on an Assembleon
Electronics Forum | Thu Sep 02 11:31:19 EDT 2004 | kmorris
Hi: I am wondering what others are doing that use a Static Ionic contaminate test (e.g. Ionograph/Alphametals) in relation to time. Our Ionograph has the option of setting a test time, or setting it to auto-terminate when there is no change in resis
