Electronics Forum | Fri Feb 19 03:50:34 EST 1999 | Steve
Hi Brent, Fuji has a solution to solve your problem. The solution Fuji has is called "Independent Function" and this function keeps working rest of module even though one module stops due to parts run out. But this function requires hardware modifica
Electronics Forum | Fri Feb 19 03:51:04 EST 1999 | Steve
Hi Brent, Fuji has a solution to solve your problem. The solution Fuji has is called "Independent Function" and this function keeps working rest of module even though one module stops due to parts run out. But this function requires hardware modifica
Electronics Forum | Wed Apr 21 19:59:43 EDT 2004 | Ken
It makes no difference if the solder is in balls, ingots, bars, paste etc. The thermal profile satisfies key areas of the reflow process as a function of your flux and alloy type. Peak and duration above liquiduous are a function of the alloy. pr
Electronics Forum | Tue Apr 05 02:30:11 EDT 2005 | Bored
Hi, I have seen in the past programs on GSMs using a pushdown function so that the selected previously placed component can be pushed once again into the paste by one of the nozzles. I have tried using greater pressure on the placement but need that
Electronics Forum | Thu Oct 13 11:19:01 EDT 2016 | chabscan
Hello, my fellow SMTnet users. I've been using my Quad 4C for some time now and I come to you with a question: What's the difference in the measurement of a leaded and a non leaded component, why does it have a different function for each one (FUNC
Electronics Forum | Wed Oct 10 12:20:44 EDT 2007 | slthomas
Does it fail to function or does it function outside of acceptable tolerances? If the latter I wouldn't know what to think, but if the former I would feel obligated to suspect solder quality or maybe even a component problem with the elevated lead-
Electronics Forum | Wed Aug 18 16:15:04 EDT 2010 | rway
I work with LabView. Give me the details of your functional testing needs and I'll see what I can do. You can contact me at: wayohm8@yahoo.com Thanks. Reese
Electronics Forum | Mon Mar 14 08:14:18 EDT 2011 | ssager
I am looking for an individual or a company that is capable of designing a function test for a simple board. Anyone have any suggestions?
Electronics Forum | Tue Nov 26 09:05:48 EST 2019 | scotceltic
Thank you for the response. Nothing in the datasheet referring to a percentage of thermal pad coverage. I am thinking along the same lines. We are not failing any thermal or functional testing as is so am thinking there is no problem here except m
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